Interfacial Microstructure and Mechanical Reliability of Sn-Ag Solder Joint on Electroless Ni-P Film

Yoshiharu Kariya, Kumiko Nakamura, Yasunori Tanaka, Masahisa Otsuka

Research output: Contribution to journalArticle

Original languageEnglish
JournalDefault journal
Publication statusPublished - 2000 Mar 1

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