Interfacial Microstructure and Mechanical Reliability of Sn-Ag Solder Joint on Electroless Ni-P Film

Yoshiharu Kariya, Kumiko Nakamura, Yasunori Tanaka, Masahisa Otsuka

Research output: Contribution to journalArticle

Original languageEnglish
JournalDefault journal
Publication statusPublished - 2000 Mar 1

Cite this

Interfacial Microstructure and Mechanical Reliability of Sn-Ag Solder Joint on Electroless Ni-P Film. / Kariya, Yoshiharu; Nakamura, Kumiko; Tanaka, Yasunori; Otsuka, Masahisa.

In: Default journal, 01.03.2000.

Research output: Contribution to journalArticle

@article{3ad89a283a9748c78bce1798b97ca3a6,
title = "Interfacial Microstructure and Mechanical Reliability of Sn-Ag Solder Joint on Electroless Ni-P Film",
author = "Yoshiharu Kariya and Kumiko Nakamura and Yasunori Tanaka and Masahisa Otsuka",
year = "2000",
month = "3",
day = "1",
language = "English",
journal = "Default journal",

}

TY - JOUR

T1 - Interfacial Microstructure and Mechanical Reliability of Sn-Ag Solder Joint on Electroless Ni-P Film

AU - Kariya, Yoshiharu

AU - Nakamura, Kumiko

AU - Tanaka, Yasunori

AU - Otsuka, Masahisa

PY - 2000/3/1

Y1 - 2000/3/1

M3 - Article

JO - Default journal

JF - Default journal

ER -