| Original language | English |
|---|---|
| Journal | Default journal |
| Publication status | Published - 2000 Mar 1 |
Interfacial Microstructure and Mechanical Reliability of Sn-Ag Solder Joint on Electroless Ni-P Film
Yoshiharu Kariya, Kumiko Nakamura, Yasunori Tanaka, Masahisa Otsuka
Research output: Contribution to journal › Article › peer-review