International individual internship based on research collaboration on engineering education and academic science

Tetsuo Oka, Masato Murakami, Masakazu Sengoku, Takashi Sato, Jun Ogawa, Kazuaki Yamagiwa, Toshio Suzuki, Shin Ya Nishimura, Futao Kaneko

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The authors have conducted the mutual exchanges of the students and professors between the universities in Japan and Germany, discussing the topics on the engineering education. On the platform, the international collaboration on the engineering education researches in assistance of the educational reform program have been carried on by the grants-in-aid of Japanese government. Since the current issues on engineering education are generally common in every country, it is beneficial for us to discuss the educational information with foreign faculty. Since the experiences of collaboration with foreign universities are profitable for students, we have been conducting the individual student exchanges on the scientific research areas with each other by the mutual contracts of MOU with German institutes. The individually-dispatched students showed us that the experiences of collaborations were will beneficial for their career-design as well as the enhancement to motivate their scientific researches. The individual internships thus processed have resulted in some academic paper publications on the collaborative researches. 21 Japanese students have studied abroad and 10 German students have studied in Niigata. 13 scientific papers co-authored by the students have been published in a decade.

Original languageEnglish
Title of host publication2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538677636
DOIs
Publication statusPublished - 2019 Jan 29
Event2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018 - Albuquerque, United States
Duration: 2018 Nov 122018 Nov 16

Publication series

Name2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018

Conference

Conference2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018
CountryUnited States
CityAlbuquerque
Period18/11/1218/11/16

Fingerprint

internship
Engineering education
Students
engineering
science
education
student
student exchange
reform program
university
educational reform
educational program
grant
experience
university teacher
assistance
Japan
career

Keywords

  • international collaboration
  • international meeting
  • internship
  • student exchange

ASJC Scopus subject areas

  • Computer Science Applications
  • Engineering (miscellaneous)
  • Education

Cite this

Oka, T., Murakami, M., Sengoku, M., Sato, T., Ogawa, J., Yamagiwa, K., ... Kaneko, F. (2019). International individual internship based on research collaboration on engineering education and academic science. In 2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018 [8629681] (2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/WEEF-GEDC.2018.8629681

International individual internship based on research collaboration on engineering education and academic science. / Oka, Tetsuo; Murakami, Masato; Sengoku, Masakazu; Sato, Takashi; Ogawa, Jun; Yamagiwa, Kazuaki; Suzuki, Toshio; Nishimura, Shin Ya; Kaneko, Futao.

2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018. Institute of Electrical and Electronics Engineers Inc., 2019. 8629681 (2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Oka, T, Murakami, M, Sengoku, M, Sato, T, Ogawa, J, Yamagiwa, K, Suzuki, T, Nishimura, SY & Kaneko, F 2019, International individual internship based on research collaboration on engineering education and academic science. in 2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018., 8629681, 2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018, Institute of Electrical and Electronics Engineers Inc., 2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018, Albuquerque, United States, 18/11/12. https://doi.org/10.1109/WEEF-GEDC.2018.8629681
Oka T, Murakami M, Sengoku M, Sato T, Ogawa J, Yamagiwa K et al. International individual internship based on research collaboration on engineering education and academic science. In 2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018. Institute of Electrical and Electronics Engineers Inc. 2019. 8629681. (2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018). https://doi.org/10.1109/WEEF-GEDC.2018.8629681
Oka, Tetsuo ; Murakami, Masato ; Sengoku, Masakazu ; Sato, Takashi ; Ogawa, Jun ; Yamagiwa, Kazuaki ; Suzuki, Toshio ; Nishimura, Shin Ya ; Kaneko, Futao. / International individual internship based on research collaboration on engineering education and academic science. 2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018. Institute of Electrical and Electronics Engineers Inc., 2019. (2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018).
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