TY - GEN
T1 - Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor
AU - Tamori, Tatsuru
AU - Akatsu, Kan
N1 - Publisher Copyright:
© 2019 The Korean Institute of Power Electronics (KIPE).
Copyright:
Copyright 2019 Elsevier B.V., All rights reserved.
PY - 2019/5
Y1 - 2019/5
N2 - Recently, a miniaturization of the inverter module in the drive system is proceeding. One of the problems of the miniaturization of the inverter module is the heat generation density increase as the inverter module becomes smaller. Since a bonding wire in the inverter module is disconnected due to heat, it is necessary to early detect the disconnection for the protection of the system. In this research, by setting a GMR sensor under the bonding wire in the inverter module, we propose a small inverter module with a built-in GMR sensor. This paper focuses on a method of disconnection detection with the GMR sensor at under the bonding wire and selecting the appropriate GMR sensor position.
AB - Recently, a miniaturization of the inverter module in the drive system is proceeding. One of the problems of the miniaturization of the inverter module is the heat generation density increase as the inverter module becomes smaller. Since a bonding wire in the inverter module is disconnected due to heat, it is necessary to early detect the disconnection for the protection of the system. In this research, by setting a GMR sensor under the bonding wire in the inverter module, we propose a small inverter module with a built-in GMR sensor. This paper focuses on a method of disconnection detection with the GMR sensor at under the bonding wire and selecting the appropriate GMR sensor position.
KW - Bonding wire
KW - GMR sensor
KW - Inverter module
UR - http://www.scopus.com/inward/record.url?scp=85071645957&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85071645957&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85071645957
T3 - ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia
SP - 1990
EP - 1995
BT - ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia
Y2 - 27 May 2019 through 30 May 2019
ER -