Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor

Tatsuru Tamori, Kan Akatsu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Recently, a miniaturization of the inverter module in the drive system is proceeding. One of the problems of the miniaturization of the inverter module is the heat generation density increase as the inverter module becomes smaller. Since a bonding wire in the inverter module is disconnected due to heat, it is necessary to early detect the disconnection for the protection of the system. In this research, by setting a GMR sensor under the bonding wire in the inverter module, we propose a small inverter module with a built-in GMR sensor. This paper focuses on a method of disconnection detection with the GMR sensor at under the bonding wire and selecting the appropriate GMR sensor position.

Original languageEnglish
Title of host publicationICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1990-1995
Number of pages6
ISBN (Electronic)9788957083130
Publication statusPublished - 2019 May 1
Event10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia - Busan, Korea, Republic of
Duration: 2019 May 272019 May 30

Publication series

NameICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia

Conference

Conference10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia
CountryKorea, Republic of
CityBusan
Period19/5/2719/5/30

Fingerprint

Miniature instruments
Electric inverters
Electric current measurement
Power electronics
Wire
Sensors
Heat generation

Keywords

  • Bonding wire
  • GMR sensor
  • Inverter module

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Control and Optimization

Cite this

Tamori, T., & Akatsu, K. (2019). Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor. In ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia (pp. 1990-1995). [8796967] (ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia). Institute of Electrical and Electronics Engineers Inc..

Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor. / Tamori, Tatsuru; Akatsu, Kan.

ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia. Institute of Electrical and Electronics Engineers Inc., 2019. p. 1990-1995 8796967 (ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tamori, T & Akatsu, K 2019, Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor. in ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia., 8796967, ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia, Institute of Electrical and Electronics Engineers Inc., pp. 1990-1995, 10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia, Busan, Korea, Republic of, 19/5/27.
Tamori T, Akatsu K. Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor. In ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia. Institute of Electrical and Electronics Engineers Inc. 2019. p. 1990-1995. 8796967. (ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia).
Tamori, Tatsuru ; Akatsu, Kan. / Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor. ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 1990-1995 (ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia).
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