@inproceedings{bea8bf1a21314614bf6e589f59d34878,
title = "Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor",
abstract = "Recently, a miniaturization of the inverter module in the drive system is proceeding. One of the problems of the miniaturization of the inverter module is the heat generation density increase as the inverter module becomes smaller. Since a bonding wire in the inverter module is disconnected due to heat, it is necessary to early detect the disconnection for the protection of the system. In this research, by setting a GMR sensor under the bonding wire in the inverter module, we propose a small inverter module with a built-in GMR sensor. This paper focuses on a method of disconnection detection with the GMR sensor at under the bonding wire and selecting the appropriate GMR sensor position.",
keywords = "Bonding wire, GMR sensor, Inverter module",
author = "Tatsuru Tamori and Kan Akatsu",
year = "2019",
month = may,
day = "1",
language = "English",
series = "ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1990--1995",
booktitle = "ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia",
note = "10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia ; Conference date: 27-05-2019 Through 30-05-2019",
}