Abstract
Recently, a miniaturization of the inverter module in the drive system is proceeding. One of the problems of the miniaturization of the inverter module is the heat generation density increase as the inverter module becomes smaller. Since a bonding wire in the inverter module is disconnected due to heat, it is necessary to early detect the disconnection for the protection of the system. In this research, by setting a GMR sensor under the bonding wire in the inverter module, we propose a small inverter module with a built-in GMR sensor. This paper focuses on a method of disconnection detection with the GMR sensor at under the bonding wire and selecting the appropriate GMR sensor position.
| Original language | English |
|---|---|
| Title of host publication | ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1990-1995 |
| Number of pages | 6 |
| ISBN (Electronic) | 9788957083130 |
| Publication status | Published - 2019 May 1 |
| Event | 10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia - Busan, Korea, Republic of Duration: 2019 May 27 → 2019 May 30 |
Publication series
| Name | ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia |
|---|
Conference
| Conference | 10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia |
|---|---|
| Country | Korea, Republic of |
| City | Busan |
| Period | 19/5/27 → 19/5/30 |
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Keywords
- Bonding wire
- GMR sensor
- Inverter module
ASJC Scopus subject areas
- Energy Engineering and Power Technology
- Electrical and Electronic Engineering
- Control and Optimization
Cite this
Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor. / Tamori, Tatsuru; Akatsu, Kan.
ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia. Institute of Electrical and Electronics Engineers Inc., 2019. p. 1990-1995 8796967 (ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor
AU - Tamori, Tatsuru
AU - Akatsu, Kan
PY - 2019/5/1
Y1 - 2019/5/1
N2 - Recently, a miniaturization of the inverter module in the drive system is proceeding. One of the problems of the miniaturization of the inverter module is the heat generation density increase as the inverter module becomes smaller. Since a bonding wire in the inverter module is disconnected due to heat, it is necessary to early detect the disconnection for the protection of the system. In this research, by setting a GMR sensor under the bonding wire in the inverter module, we propose a small inverter module with a built-in GMR sensor. This paper focuses on a method of disconnection detection with the GMR sensor at under the bonding wire and selecting the appropriate GMR sensor position.
AB - Recently, a miniaturization of the inverter module in the drive system is proceeding. One of the problems of the miniaturization of the inverter module is the heat generation density increase as the inverter module becomes smaller. Since a bonding wire in the inverter module is disconnected due to heat, it is necessary to early detect the disconnection for the protection of the system. In this research, by setting a GMR sensor under the bonding wire in the inverter module, we propose a small inverter module with a built-in GMR sensor. This paper focuses on a method of disconnection detection with the GMR sensor at under the bonding wire and selecting the appropriate GMR sensor position.
KW - Bonding wire
KW - GMR sensor
KW - Inverter module
UR - http://www.scopus.com/inward/record.url?scp=85071645957&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85071645957&partnerID=8YFLogxK
M3 - Conference contribution
T3 - ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia
SP - 1990
EP - 1995
BT - ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia
PB - Institute of Electrical and Electronics Engineers Inc.
ER -