| Original language | English |
|---|---|
| Pages (from-to) | 1679-1684 |
| Journal | Proc. of Fifth Japan International SAMPE Symposium |
| Volume | 5 |
| Publication status | Published - 1997 Oct 1 |
Cite this
Kariya, Y., & Otsuka, M. (1997). Isothermal Fatigue Characteristics of Sn-3.5Ag-X(Bi,Cu,Zn)Solder Alloy. Proc. of Fifth Japan International SAMPE Symposium, 5, 1679-1684.
Isothermal Fatigue Characteristics of Sn-3.5Ag-X(Bi,Cu,Zn)Solder Alloy. / Kariya, Yoshiharu; Otsuka, Masahsa.
In: Proc. of Fifth Japan International SAMPE Symposium, Vol. 5, 01.10.1997, p. 1679-1684.Research output: Contribution to journal › Article
Kariya, Y & Otsuka, M 1997, 'Isothermal Fatigue Characteristics of Sn-3.5Ag-X(Bi,Cu,Zn)Solder Alloy', Proc. of Fifth Japan International SAMPE Symposium, vol. 5, pp. 1679-1684.
Kariya Y, Otsuka M. Isothermal Fatigue Characteristics of Sn-3.5Ag-X(Bi,Cu,Zn)Solder Alloy. Proc. of Fifth Japan International SAMPE Symposium. 1997 Oct 1;5:1679-1684.
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