Isothermal fatigue properties of Sn-Ag-Cu alloy evaluated by micro size specimen

Yoshiharu Kariya, Tomokazu Niimi, Tadatomo Suga, Masahisa Otsuka

Research output: Contribution to journalArticle

42 Citations (Scopus)

Abstract

Micro-bulk fatigue testing developed to investigate the fatigue lives and damage mechanisms of Sn-3.0Ag-0.5Cu and Sn-37Pb solder alloys. The fatigue life of micro-bulk solder obeyed Manson-Coffin's empirical law, and the fatigue ductility exponents were about 0.5 for both Sn-Ag-Cu and Sn-Pb alloys. The fatigue life of Sn-3.0Ag-0.5Cu alloy was 10 times longer than that of Sn-37Pb alloy under symmetrical cycling at 298 K, although fatigue resistance of Sn-3.OAg-0.5Cu alloy was not very superior under asymmetrical wave and elevated temperature condition. The fatigue crack was developed from extrusion and intrusion of slip band in Sn-3.0Ag-0.5Cu alloy, while the crack was observed at colony boundary and grain boundary in Sn-37Pb alloy. The difference in damage mechanism may affect the susceptibility to fatigue life test condition of reversibility.

Original languageEnglish
Pages (from-to)2309-2315
Number of pages7
JournalMaterials Transactions
Volume46
Issue number11
DOIs
Publication statusPublished - 2005 Nov
Externally publishedYes

Fingerprint

Fatigue of materials
fatigue life
solders
Soldering alloys
cracks
damage
Fatigue testing
edge dislocations
Fatigue damage
ductility
intrusion
Extrusion
Ductility
Grain boundaries
grain boundaries
exponents
Cracks
magnetic permeability
cycles
Temperature

Keywords

  • Crack initiation
  • Damage mechanism
  • Fatigue life
  • Lead-free solder
  • Micro-bulk
  • Miniature testing
  • Solder
  • Tin-lead
  • Tin-silver-copper

ASJC Scopus subject areas

  • Materials Science(all)
  • Metals and Alloys

Cite this

Isothermal fatigue properties of Sn-Ag-Cu alloy evaluated by micro size specimen. / Kariya, Yoshiharu; Niimi, Tomokazu; Suga, Tadatomo; Otsuka, Masahisa.

In: Materials Transactions, Vol. 46, No. 11, 11.2005, p. 2309-2315.

Research output: Contribution to journalArticle

Kariya, Yoshiharu ; Niimi, Tomokazu ; Suga, Tadatomo ; Otsuka, Masahisa. / Isothermal fatigue properties of Sn-Ag-Cu alloy evaluated by micro size specimen. In: Materials Transactions. 2005 ; Vol. 46, No. 11. pp. 2309-2315.
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