Abstract
Micro-bulk fatigue testing developed to investigate the fatigue lives and damage mechanisms of Sn-3.0Ag-0.5Cu and Sn-37Pb solder alloys. The fatigue life of micro-bulk solder obeyed Manson-Coffin's empirical law, and the fatigue ductility exponents were about 0.5 for both Sn-Ag-Cu and Sn-Pb alloys. The fatigue life of Sn-3.0Ag-0.5Cu alloy was 10 times longer than that of Sn-37Pb alloy under symmetrical cycling at 298 K, although fatigue resistance of Sn-3.OAg-0.5Cu alloy was not very superior under asymmetrical wave and elevated temperature condition. The fatigue crack was developed from extrusion and intrusion of slip band in Sn-3.0Ag-0.5Cu alloy, while the crack was observed at colony boundary and grain boundary in Sn-37Pb alloy. The difference in damage mechanism may affect the susceptibility to fatigue life test condition of reversibility.
| Original language | English |
|---|---|
| Pages (from-to) | 2309-2315 |
| Number of pages | 7 |
| Journal | Materials Transactions |
| Volume | 46 |
| Issue number | 11 |
| DOIs | |
| Publication status | Published - 2005 Nov |
| Externally published | Yes |
Keywords
- Crack initiation
- Damage mechanism
- Fatigue life
- Lead-free solder
- Micro-bulk
- Miniature testing
- Solder
- Tin-lead
- Tin-silver-copper
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering