Isothermal Fatigue Properties of Sn-Ag-Cu Alloy Evalulated by Micro Size Specimen

Yoshiharu Kariya, Tomokazu Niimi, Tadatomo Suga, Masahisa Otsuka

Research output: Contribution to journal › Article

Original languageEnglish
Pages (from-to)2309-2315
JournalMaterials Transactions
Volume46
Publication statusPublished - 2005 Nov 15

Cite this

Isothermal Fatigue Properties of Sn-Ag-Cu Alloy Evalulated by Micro Size Specimen. / Kariya, Yoshiharu; Niimi, Tomokazu; Suga, Tadatomo; Otsuka, Masahisa.

In: Materials Transactions, Vol. 46, 15.11.2005, p. 2309-2315.

Research output: Contribution to journal › Article

Kariya, Y, Niimi, T, Suga, T & Otsuka, M 2005, 'Isothermal Fatigue Properties of Sn-Ag-Cu Alloy Evalulated by Micro Size Specimen', Materials Transactions, vol. 46, pp. 2309-2315.
Kariya Y, Niimi T, Suga T, Otsuka M. Isothermal Fatigue Properties of Sn-Ag-Cu Alloy Evalulated by Micro Size Specimen. Materials Transactions. 2005 Nov 15;46:2309-2315.
Kariya, Yoshiharu ; Niimi, Tomokazu ; Suga, Tadatomo ; Otsuka, Masahisa. / Isothermal Fatigue Properties of Sn-Ag-Cu Alloy Evalulated by Micro Size Specimen. In: Materials Transactions. 2005 ; Vol. 46. pp. 2309-2315.
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