Isothermal shear fatigue life of Sn-xAg-0.5Cu flip chip interconnects

Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahisa Otsuka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The mechanical shear fatigue test has been performed to look for the effect of silver content on the fatigue properties of Sn-xAg-0.5Cu (x=1, 2, 3 and 4) flip chip interconnections. As the strength of the solder alloy increases with increasing silver content, the increase in silver content results in preventing a shear plastic deformation of solder bump. Therefore, the flip chip joints made using higher silver content solder such as 3 and 4Ag exhibit longer fatigue life, if the same levels of displacement is applied. The fatigue ductility of the solder decreases with increasing the silver content. Therefore, the fatigue endurance of the 1Ag solder itself is superior to other solders in high plastic strain regime, even though the strength of the solder is the lowest in the solders tested. Based on this study, the 3Ag solder might exhibit good fatigue performance for all condition, and the 1Ag solder is optimum for severe strain condition.

Original languageEnglish
Title of host publicationAdvances in Electronic Packaging
Pages155-160
Number of pages6
Volume1
Publication statusPublished - 2003
Externally publishedYes
Event2003 International Electronic Packaging Technical Conference and Exhibition - Haui, HI
Duration: 2003 Jul 62003 Jul 11

Other

Other2003 International Electronic Packaging Technical Conference and Exhibition
CityHaui, HI
Period03/7/603/7/11

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Keywords

  • BGA joints
  • Fatigue life
  • Flip chip
  • Lead-free solder
  • Life prediction
  • Silver content
  • Sn-Ag-Cu

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Kariya, Y., Hosoi, T., Terashima, S., Tanaka, M., & Otsuka, M. (2003). Isothermal shear fatigue life of Sn-xAg-0.5Cu flip chip interconnects. In Advances in Electronic Packaging (Vol. 1, pp. 155-160)