Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects

Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahisa Otsuka

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)155-160
JournalASME IPACK2003
Publication statusPublished - 2003 Jul 6

Cite this

Kariya, Y., Hosoi, T., Terashima, S., Tanaka, M., & Otsuka, M. (2003). Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects. ASME IPACK2003, 155-160.