Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects

Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahisa Otsuka

Research output: Contribution to journal › Article › peer-review

Cite this

@article{6a02790961a54e68919c566bbcf9cf27,

title = "Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects",

author = "Yoshiharu Kariya and Takuya Hosoi and Shinichi Terashima and Masamoto Tanaka and Masahisa Otsuka",

year = "2003",

month = jul,

day = "6",

language = "English",

pages = "155--160",

journal = "ASME IPACK2003",

}