Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects

Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahisa Otsuka

Research output: Contribution to journal › Article

Original languageEnglish
Pages (from-to)155-160
JournalASME IPACK2003
Publication statusPublished - 2003 Jul 6

Cite this

Kariya, Y., Hosoi, T., Terashima, S., Tanaka, M., & Otsuka, M. (2003). Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects. ASME IPACK2003, 155-160.

Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects. / Kariya, Yoshiharu; Hosoi, Takuya; Terashima, Shinichi; Tanaka, Masamoto; Otsuka, Masahisa.

In: ASME IPACK2003, 06.07.2003, p. 155-160.

Research output: Contribution to journal › Article

Kariya, Y, Hosoi, T, Terashima, S, Tanaka, M & Otsuka, M 2003, 'Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects', ASME IPACK2003, pp. 155-160.
Kariya Y, Hosoi T, Terashima S, Tanaka M, Otsuka M. Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects. ASME IPACK2003. 2003 Jul 6;155-160.
Kariya, Yoshiharu ; Hosoi, Takuya ; Terashima, Shinichi ; Tanaka, Masamoto ; Otsuka, Masahisa. / Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects. In: ASME IPACK2003. 2003 ; pp. 155-160.
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