Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects

Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahisa Otsuka

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)155-160
JournalASME IPACK2003
Publication statusPublished - 2003 Jul 6

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