Joining of Y-Ba-Cu-O/Ag bulk superconductors using Er-Ba-Cu-O/Ag solder

K. Iida, T. Kono, T. Kaneko, K. Katagiri, Naomichi Sakai, Masato Murakami, N. Koshizuka

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Ag-added Y-Ba-Cu-O bulk superconductors were joined using Ag-added Er-Ba-Cu-O solder and different Er211 contents. Microstructural analysis revealed that the volume fraction of Er211 at the joint with a composition of Erl23:Er211 = 4:1 was the same as that for the expected volume fraction of the initial composition. That is, this composition seems to be optimum, since the mass balance was maintained during the crystal growth from the initial growth stage to the final stage. The trapped-field distribution for the joint using this composition was uniform and the only single peak indicated that strong coupling was achieved.

Original languageEnglish
JournalSuperconductor Science and Technology
Volume17
Issue number2
DOIs
Publication statusPublished - 2004 Feb

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solders
Joining
Soldering alloys
Superconducting materials
Chemical analysis
Volume fraction
mass balance
Crystallization
Crystal growth
crystal growth

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Joining of Y-Ba-Cu-O/Ag bulk superconductors using Er-Ba-Cu-O/Ag solder. / Iida, K.; Kono, T.; Kaneko, T.; Katagiri, K.; Sakai, Naomichi; Murakami, Masato; Koshizuka, N.

In: Superconductor Science and Technology, Vol. 17, No. 2, 02.2004.

Research output: Contribution to journalArticle

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AU - Koshizuka, N.

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