Joining of Y-Ba-Cu-O/Ag bulk superconductors using Er-Ba-Cu-O/Ag solder

K. Iida, T. Kono, T. Kaneko, K. Katagiri, N. Sakai, M. Murakami, N. Koshizuka

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Joining of Y-Ba-Cu-O/Ag bulk superconductors using Er-Ba-Cu-O/Ag solder'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds

Physics & Astronomy