| Original language | English |
|---|---|
| Pages (from-to) | 144-145 |
| Journal | Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat. |
| Publication status | Published - 2006 Sep 13 |
Cite this
Kakuhara, Y., Kawahara;K.Ueno, Y. KN., N.Oda, N. O., & Ueno, K. (2006). Key mechanism for improved EM lifetime of CoWP capped Cu interconnects. Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat., 144-145.
Key mechanism for improved EM lifetime of CoWP capped Cu interconnects. / Kakuhara, Y.; Kawahara;K.Ueno, Y. Kakuhara;N.; N.Oda, N.Oda; Ueno, Kazuyoshi.
In: Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat., 13.09.2006, p. 144-145.Research output: Contribution to journal › Article
Kakuhara, Y, Kawahara;K.Ueno, YKN, N.Oda, NO & Ueno, K 2006, 'Key mechanism for improved EM lifetime of CoWP capped Cu interconnects', Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat., pp. 144-145.
Kakuhara Y, Kawahara;K.Ueno YKN, N.Oda NO, Ueno K. Key mechanism for improved EM lifetime of CoWP capped Cu interconnects. Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat. 2006 Sep 13;144-145.
@article{bac45875a53344cb95af371ea27329b7,
title = "Key mechanism for improved EM lifetime of CoWP capped Cu interconnects",
author = "Y. Kakuhara and Kawahara;K.Ueno, {Y. Kakuhara;N.} and N.Oda N.Oda and Kazuyoshi Ueno",
year = "2006",
month = "9",
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language = "English",
pages = "144--145",
journal = "Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat.",
}
TY - JOUR
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AU - Kakuhara, Y.
AU - Kawahara;K.Ueno, Y. Kakuhara;N.
AU - N.Oda, N.Oda
AU - Ueno, Kazuyoshi
PY - 2006/9/13
Y1 - 2006/9/13
M3 - Article
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EP - 145
JO - Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat.
JF - Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat.
ER -