Original language | English |
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Pages (from-to) | 144-145 |
Journal | Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat. |
Publication status | Published - 2006 Sep 13 |
Key mechanism for improved EM lifetime of CoWP capped Cu interconnects
Y. Kakuhara, Y. Kakuhara;N. Kawahara;K.Ueno, N.Oda N.Oda, Kazuyoshi Ueno
Research output: Contribution to journal › Article › peer-review