Key mechanism for improved EM lifetime of CoWP capped Cu interconnects

Y. Kakuhara, Y. Kakuhara;N. Kawahara;K.Ueno, N.Oda N.Oda, Kazuyoshi Ueno

Research output: Contribution to journal › Article

Original language	English
Pages (from-to)	144-145
Journal	Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat.
Publication status	Published - 2006 Sep 13

Cite this

@article{bac45875a53344cb95af371ea27329b7,

title = "Key mechanism for improved EM lifetime of CoWP capped Cu interconnects",

author = "Y. Kakuhara and Kawahara;K.Ueno, {Y. Kakuhara;N.} and N.Oda N.Oda and Kazuyoshi Ueno",

year = "2006",

month = sep,

day = "13",

language = "English",

pages = "144--145",

journal = "Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat.",

}

TY - JOUR

T1 - Key mechanism for improved EM lifetime of CoWP capped Cu interconnects

AU - Kakuhara, Y.

AU - Kawahara;K.Ueno, Y. Kakuhara;N.

AU - N.Oda, N.Oda

AU - Ueno, Kazuyoshi

PY - 2006/9/13

Y1 - 2006/9/13

M3 - Article

SP - 144

EP - 145

JO - Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat.

JF - Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat.

ER -