Laser internal modification plus wet etching for micro-structuring crystalline and glassy materials

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The development of fs laser technology has enabled the internal modification of transparent solid materials, performed by focusing femtosecond (fs) pulses. Using internal modification and subsequent wet etching, micrometer-scale removal processing with arbitrary three-dimensional design was enabled. We applied this technique to transparent nonphotosensitive crystalline and glassy materials. This is a unique processing technique almost impossible by other techniques.

Original languageEnglish
Title of host publicationICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings
PublisherLaser Institute of America
Pages942-945
Number of pages4
ISBN (Print)9780912035598
DOIs
Publication statusPublished - 2009 Jan 1
Externally publishedYes
Event28th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2009 - Orlando, FL, United States
Duration: 2009 Nov 22009 Nov 5

Publication series

NameICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings
Volume102

Conference

Conference28th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2009
CountryUnited States
CityOrlando, FL
Period09/11/209/11/5

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Matsuo, S. (2009). Laser internal modification plus wet etching for micro-structuring crystalline and glassy materials. In ICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings (pp. 942-945). (ICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings; Vol. 102). Laser Institute of America. https://doi.org/10.2351/1.5061669