Laser internal modification plus wet etching for micro-structuring crystalline and glassy materials

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The development of fs laser technology has enabled the internal modification of transparent solid materials, performed by focusing femtosecond (fs) pulses. Using internal modification and subsequent wet etching, micrometer-scale removal processing with arbitrary three-dimensional design was enabled. We applied this technique to transparent nonphotosensitive crystalline and glassy materials. This is a unique processing technique almost impossible by other techniques.

Original languageEnglish
Title of host publicationICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings
Pages942-945
Number of pages4
Volume102
Publication statusPublished - 2009
Externally publishedYes
Event28th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2009 - Orlando, FL
Duration: 2009 Nov 22009 Nov 5

Other

Other28th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2009
CityOrlando, FL
Period09/11/209/11/5

Fingerprint

Wet etching
Ultrashort pulses
Descaling
Crystalline materials
Lasers
Processing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Matsuo, S. (2009). Laser internal modification plus wet etching for micro-structuring crystalline and glassy materials. In ICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings (Vol. 102, pp. 942-945)

Laser internal modification plus wet etching for micro-structuring crystalline and glassy materials. / Matsuo, Shigeki.

ICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings. Vol. 102 2009. p. 942-945.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Matsuo, S 2009, Laser internal modification plus wet etching for micro-structuring crystalline and glassy materials. in ICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings. vol. 102, pp. 942-945, 28th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2009, Orlando, FL, 09/11/2.
Matsuo S. Laser internal modification plus wet etching for micro-structuring crystalline and glassy materials. In ICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings. Vol. 102. 2009. p. 942-945
Matsuo, Shigeki. / Laser internal modification plus wet etching for micro-structuring crystalline and glassy materials. ICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings. Vol. 102 2009. pp. 942-945
@inproceedings{be4e892db9f94ea8acd1a12b65008b2c,
title = "Laser internal modification plus wet etching for micro-structuring crystalline and glassy materials",
abstract = "The development of fs laser technology has enabled the internal modification of transparent solid materials, performed by focusing femtosecond (fs) pulses. Using internal modification and subsequent wet etching, micrometer-scale removal processing with arbitrary three-dimensional design was enabled. We applied this technique to transparent nonphotosensitive crystalline and glassy materials. This is a unique processing technique almost impossible by other techniques.",
author = "Shigeki Matsuo",
year = "2009",
language = "English",
isbn = "9780912035598",
volume = "102",
pages = "942--945",
booktitle = "ICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings",

}

TY - GEN

T1 - Laser internal modification plus wet etching for micro-structuring crystalline and glassy materials

AU - Matsuo, Shigeki

PY - 2009

Y1 - 2009

N2 - The development of fs laser technology has enabled the internal modification of transparent solid materials, performed by focusing femtosecond (fs) pulses. Using internal modification and subsequent wet etching, micrometer-scale removal processing with arbitrary three-dimensional design was enabled. We applied this technique to transparent nonphotosensitive crystalline and glassy materials. This is a unique processing technique almost impossible by other techniques.

AB - The development of fs laser technology has enabled the internal modification of transparent solid materials, performed by focusing femtosecond (fs) pulses. Using internal modification and subsequent wet etching, micrometer-scale removal processing with arbitrary three-dimensional design was enabled. We applied this technique to transparent nonphotosensitive crystalline and glassy materials. This is a unique processing technique almost impossible by other techniques.

UR - http://www.scopus.com/inward/record.url?scp=77953885819&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77953885819&partnerID=8YFLogxK

M3 - Conference contribution

SN - 9780912035598

VL - 102

SP - 942

EP - 945

BT - ICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings

ER -