Lifetime prediction model of Cu-based metallization against moisture under temperature and humidity accelerations

Ploybussara Gomasang, Satoru Ogiue, Shinji Yokogawa, Kazuyoshi Ueno

Research output: Contribution to journalArticle


To establish the lifetime prediction model for Cu-based metallization against moisture, temperature humidity storage test under the various accelerated conditions is performed. The increase of Cu sheet resistance induced by Cu-oxidation is measured by a four-point probe method. X-ray photoelectron spectroscopy analysis is carried out to investigate the variation of oxidized Cu. The activation energy and the humidity acceleration factor for Cu-based metallization have been derived by the statistical analysis to predict the lifetime against moisture for the first time. The results indicate that Cu-based metallization is comparatively more sensitive to the temperature than humidity at around the practical use condition.

Original languageEnglish
Article numberSBBC01
JournalJapanese Journal of Applied Physics
Publication statusPublished - 2019 Jan 1


ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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