Lifetime prediction model of Cu-based metallization against moisture under temperature and humidity accelerations

Ploybussara Gomasang, Satoru Ogiue, Shinji Yokogawa, Kazuyoshi Ueno

Research output: Contribution to journalArticle

Abstract

To establish the lifetime prediction model for Cu-based metallization against moisture, temperature humidity storage test under the various accelerated conditions is performed. The increase of Cu sheet resistance induced by Cu-oxidation is measured by a four-point probe method. X-ray photoelectron spectroscopy analysis is carried out to investigate the variation of oxidized Cu. The activation energy and the humidity acceleration factor for Cu-based metallization have been derived by the statistical analysis to predict the lifetime against moisture for the first time. The results indicate that Cu-based metallization is comparatively more sensitive to the temperature than humidity at around the practical use condition.

Original languageEnglish
Article numberSBBC01
JournalJapanese Journal of Applied Physics
Volume58
DOIs
Publication statusPublished - 2019 Jan 1

Fingerprint

Metallizing
moisture
humidity
Atmospheric humidity
Moisture
life (durability)
predictions
Sheet resistance
statistical analysis
Temperature
temperature
Statistical methods
X ray photoelectron spectroscopy
Activation energy
photoelectron spectroscopy
activation energy
Oxidation
oxidation
x rays

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Lifetime prediction model of Cu-based metallization against moisture under temperature and humidity accelerations. / Gomasang, Ploybussara; Ogiue, Satoru; Yokogawa, Shinji; Ueno, Kazuyoshi.

In: Japanese Journal of Applied Physics, Vol. 58, SBBC01, 01.01.2019.

Research output: Contribution to journalArticle

@article{7de6d8aa094747e3a63d22f4261d43f1,
title = "Lifetime prediction model of Cu-based metallization against moisture under temperature and humidity accelerations",
abstract = "To establish the lifetime prediction model for Cu-based metallization against moisture, temperature humidity storage test under the various accelerated conditions is performed. The increase of Cu sheet resistance induced by Cu-oxidation is measured by a four-point probe method. X-ray photoelectron spectroscopy analysis is carried out to investigate the variation of oxidized Cu. The activation energy and the humidity acceleration factor for Cu-based metallization have been derived by the statistical analysis to predict the lifetime against moisture for the first time. The results indicate that Cu-based metallization is comparatively more sensitive to the temperature than humidity at around the practical use condition.",
author = "Ploybussara Gomasang and Satoru Ogiue and Shinji Yokogawa and Kazuyoshi Ueno",
year = "2019",
month = "1",
day = "1",
doi = "10.7567/1347-4065/aafe6a",
language = "English",
volume = "58",
journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",
issn = "0021-4922",
publisher = "Japan Society of Applied Physics",

}

TY - JOUR

T1 - Lifetime prediction model of Cu-based metallization against moisture under temperature and humidity accelerations

AU - Gomasang, Ploybussara

AU - Ogiue, Satoru

AU - Yokogawa, Shinji

AU - Ueno, Kazuyoshi

PY - 2019/1/1

Y1 - 2019/1/1

N2 - To establish the lifetime prediction model for Cu-based metallization against moisture, temperature humidity storage test under the various accelerated conditions is performed. The increase of Cu sheet resistance induced by Cu-oxidation is measured by a four-point probe method. X-ray photoelectron spectroscopy analysis is carried out to investigate the variation of oxidized Cu. The activation energy and the humidity acceleration factor for Cu-based metallization have been derived by the statistical analysis to predict the lifetime against moisture for the first time. The results indicate that Cu-based metallization is comparatively more sensitive to the temperature than humidity at around the practical use condition.

AB - To establish the lifetime prediction model for Cu-based metallization against moisture, temperature humidity storage test under the various accelerated conditions is performed. The increase of Cu sheet resistance induced by Cu-oxidation is measured by a four-point probe method. X-ray photoelectron spectroscopy analysis is carried out to investigate the variation of oxidized Cu. The activation energy and the humidity acceleration factor for Cu-based metallization have been derived by the statistical analysis to predict the lifetime against moisture for the first time. The results indicate that Cu-based metallization is comparatively more sensitive to the temperature than humidity at around the practical use condition.

UR - http://www.scopus.com/inward/record.url?scp=85065642186&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85065642186&partnerID=8YFLogxK

U2 - 10.7567/1347-4065/aafe6a

DO - 10.7567/1347-4065/aafe6a

M3 - Article

VL - 58

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

M1 - SBBC01

ER -