Lossy transmission line effects in a thin-film multichip module

Toshio Sudo

Lossy transmission line effects in a thin-film multichip module

Toshio Sudo

Electrical Engineering and Computer Science

Research output: Contribution to journal › Conference article › peer-review

Abstract

The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced.

Original language	English
Pages (from-to)	2304-2307
Number of pages	4
Journal	Proceedings - IEEE International Symposium on Circuits and Systems
Volume	4
Publication status	Published - 1991 Dec 1
Event	1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5) - Singapore, Singapore Duration: 1991 Jun 11 → 1991 Jun 14

ASJC Scopus subject areas

Electrical and Electronic Engineering

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@article{50bb9f810ad64b0287618cf9e8842120,

title = "Lossy transmission line effects in a thin-film multichip module",

abstract = "The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced.",

author = "Toshio Sudo",

year = "1991",

month = dec,

day = "1",

language = "English",

volume = "4",

pages = "2304--2307",

journal = "Proceedings - IEEE International Symposium on Circuits and Systems",

issn = "0271-4310",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5) ; Conference date: 11-06-1991 Through 14-06-1991",

}

TY - JOUR

T1 - Lossy transmission line effects in a thin-film multichip module

AU - Sudo, Toshio

PY - 1991/12/1

Y1 - 1991/12/1

N2 - The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced.

AB - The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced.

UR - http://www.scopus.com/inward/record.url?scp=0026284635&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0026284635&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0026284635

VL - 4

SP - 2304

EP - 2307

JO - Proceedings - IEEE International Symposium on Circuits and Systems

JF - Proceedings - IEEE International Symposium on Circuits and Systems

SN - 0271-4310

T2 - 1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5)

Y2 - 11 June 1991 through 14 June 1991

ER -