Abstract
The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - IEEE International Symposium on Circuits and Systems |
| Publisher | Publ by IEEE |
| Pages | 2304-2307 |
| Number of pages | 4 |
| Volume | 4 |
| Publication status | Published - 1991 |
| Event | 1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5) - Singapore, Singapore Duration: 1991 Jun 11 → 1991 Jun 14 |
Other
| Other | 1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5) |
|---|---|
| City | Singapore, Singapore |
| Period | 91/6/11 → 91/6/14 |
Fingerprint
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
Cite this
Lossy transmission line effects in a thin-film multichip module. / Sudo, Toshio.
Proceedings - IEEE International Symposium on Circuits and Systems. Vol. 4 Publ by IEEE, 1991. p. 2304-2307.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Lossy transmission line effects in a thin-film multichip module
AU - Sudo, Toshio
PY - 1991
Y1 - 1991
N2 - The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced.
AB - The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced.
UR - http://www.scopus.com/inward/record.url?scp=0026284635&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0026284635&partnerID=8YFLogxK
M3 - Conference contribution
VL - 4
SP - 2304
EP - 2307
BT - Proceedings - IEEE International Symposium on Circuits and Systems
PB - Publ by IEEE
ER -