The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced.
|Number of pages||4|
|Journal||Proceedings - IEEE International Symposium on Circuits and Systems|
|Publication status||Published - 1991 Dec 1|
|Event||1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5) - Singapore, Singapore|
Duration: 1991 Jun 11 → 1991 Jun 14
ASJC Scopus subject areas
- Electrical and Electronic Engineering