Abstract
The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced.
| Original language | English |
|---|---|
| Pages (from-to) | 2304-2307 |
| Number of pages | 4 |
| Journal | Proceedings - IEEE International Symposium on Circuits and Systems |
| Volume | 4 |
| Publication status | Published - 1991 Dec 1 |
| Event | 1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5) - Singapore, Singapore Duration: 1991 Jun 11 → 1991 Jun 14 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering