Lossy transmission line effects in a thin-film multichip module

Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced.

Original languageEnglish
Title of host publicationProceedings - IEEE International Symposium on Circuits and Systems
PublisherPubl by IEEE
Pages2304-2307
Number of pages4
Volume4
Publication statusPublished - 1991
Event1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5) - Singapore, Singapore
Duration: 1991 Jun 111991 Jun 14

Other

Other1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5)
CitySingapore, Singapore
Period91/6/1191/6/14

Fingerprint

Multichip modules
Electric lines
Thin films
SPICE
Energy dissipation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Sudo, T. (1991). Lossy transmission line effects in a thin-film multichip module. In Proceedings - IEEE International Symposium on Circuits and Systems (Vol. 4, pp. 2304-2307). Publ by IEEE.

Lossy transmission line effects in a thin-film multichip module. / Sudo, Toshio.

Proceedings - IEEE International Symposium on Circuits and Systems. Vol. 4 Publ by IEEE, 1991. p. 2304-2307.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sudo, T 1991, Lossy transmission line effects in a thin-film multichip module. in Proceedings - IEEE International Symposium on Circuits and Systems. vol. 4, Publ by IEEE, pp. 2304-2307, 1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5), Singapore, Singapore, 91/6/11.
Sudo T. Lossy transmission line effects in a thin-film multichip module. In Proceedings - IEEE International Symposium on Circuits and Systems. Vol. 4. Publ by IEEE. 1991. p. 2304-2307
Sudo, Toshio. / Lossy transmission line effects in a thin-film multichip module. Proceedings - IEEE International Symposium on Circuits and Systems. Vol. 4 Publ by IEEE, 1991. pp. 2304-2307
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