Lossy transmission line effects in a thin-film multichip module

Toshio Sudo

Research output: Contribution to journalConference article

Abstract

The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced.

Original languageEnglish
Pages (from-to)2304-2307
Number of pages4
JournalProceedings - IEEE International Symposium on Circuits and Systems
Volume4
Publication statusPublished - 1991 Dec 1
Event1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5) - Singapore, Singapore
Duration: 1991 Jun 111991 Jun 14

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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