Low-cycle fatigue properties of eutectic solders at high temperatures

Yoshiharu Kariya; Tadatomo Suga

doi:10.1111/j.1460-2695.2006.01091.x

Low-cycle fatigue properties of eutectic solders at high temperatures

Yoshiharu Kariya, Tadatomo Suga

Research output: Contribution to journal › Article › peer-review

20 Citations (Scopus)

Abstract

This paper details the deformation mechanism and low-cycle fatigue life of eutectic solder alloys at high temperature (around 0.8 T_m). Grain boundary sliding generally nucleates a wedge-type cavity that reduces the low-cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn-Ag-Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb-Sn and Bi-Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low-cycle fatigue endurance for theses eutectic Pb-Sn and Bi-Sn alloys.

Original language	English
Pages (from-to)	413-419
Number of pages	7
Journal	Fatigue and Fracture of Engineering Materials and Structures
Volume	30
Issue number	5
DOIs	https://doi.org/10.1111/j.1460-2695.2006.01091.x
Publication status	Published - 2007 May 1

Keywords

Creep
Grain boundary sliding
Lead-free solder
Low-cycle fatigue
Miniature testing
Sn-3.0Ag-0.5Cu
Sn-37Pb
Sn-57Bi

ASJC Scopus subject areas

Materials Science(all)
Mechanics of Materials
Mechanical Engineering

Access to Document

10.1111/j.1460-2695.2006.01091.x

Cite this

@article{3b3192f539d34395a8aa27a8b25eab64,

title = "Low-cycle fatigue properties of eutectic solders at high temperatures",

abstract = "This paper details the deformation mechanism and low-cycle fatigue life of eutectic solder alloys at high temperature (around 0.8 Tm). Grain boundary sliding generally nucleates a wedge-type cavity that reduces the low-cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn-Ag-Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb-Sn and Bi-Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low-cycle fatigue endurance for theses eutectic Pb-Sn and Bi-Sn alloys.",

keywords = "Creep, Grain boundary sliding, Lead-free solder, Low-cycle fatigue, Miniature testing, Sn-3.0Ag-0.5Cu, Sn-37Pb, Sn-57Bi",

author = "Yoshiharu Kariya and Tadatomo Suga",

year = "2007",

month = may,

day = "1",

doi = "10.1111/j.1460-2695.2006.01091.x",

language = "English",

volume = "30",

pages = "413--419",

journal = "Fatigue and Fracture of Engineering Materials and Structures",

issn = "8756-758X",

publisher = "Wiley-Blackwell",

number = "5",

}

TY - JOUR

T1 - Low-cycle fatigue properties of eutectic solders at high temperatures

AU - Kariya, Yoshiharu

AU - Suga, Tadatomo

PY - 2007/5/1

Y1 - 2007/5/1

N2 - This paper details the deformation mechanism and low-cycle fatigue life of eutectic solder alloys at high temperature (around 0.8 Tm). Grain boundary sliding generally nucleates a wedge-type cavity that reduces the low-cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn-Ag-Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb-Sn and Bi-Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low-cycle fatigue endurance for theses eutectic Pb-Sn and Bi-Sn alloys.

AB - This paper details the deformation mechanism and low-cycle fatigue life of eutectic solder alloys at high temperature (around 0.8 Tm). Grain boundary sliding generally nucleates a wedge-type cavity that reduces the low-cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn-Ag-Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb-Sn and Bi-Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low-cycle fatigue endurance for theses eutectic Pb-Sn and Bi-Sn alloys.

KW - Creep

KW - Grain boundary sliding

KW - Lead-free solder

KW - Low-cycle fatigue

KW - Miniature testing

KW - Sn-3.0Ag-0.5Cu

KW - Sn-37Pb

KW - Sn-57Bi

UR - http://www.scopus.com/inward/record.url?scp=34247635676&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34247635676&partnerID=8YFLogxK

U2 - 10.1111/j.1460-2695.2006.01091.x

DO - 10.1111/j.1460-2695.2006.01091.x

M3 - Article

AN - SCOPUS:34247635676

VL - 30

SP - 413

EP - 419

JO - Fatigue and Fracture of Engineering Materials and Structures

JF - Fatigue and Fracture of Engineering Materials and Structures

SN - 8756-758X

IS - 5

ER -

Low-cycle fatigue properties of eutectic solders at high temperatures

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this