Abstract
This paper details the deformation mechanism and low-cycle fatigue life of eutectic solder alloys at high temperature (around 0.8 Tm). Grain boundary sliding generally nucleates a wedge-type cavity that reduces the low-cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn-Ag-Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb-Sn and Bi-Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low-cycle fatigue endurance for theses eutectic Pb-Sn and Bi-Sn alloys.
| Original language | English |
|---|---|
| Pages (from-to) | 413-419 |
| Number of pages | 7 |
| Journal | Fatigue and Fracture of Engineering Materials and Structures |
| Volume | 30 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 2007 May |
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Keywords
- Creep
- Grain boundary sliding
- Lead-free solder
- Low-cycle fatigue
- Miniature testing
- Sn-3.0Ag-0.5Cu
- Sn-37Pb
- Sn-57Bi
ASJC Scopus subject areas
- Mechanical Engineering
- Materials Science(all)
Cite this
Low-cycle fatigue properties of eutectic solders at high temperatures. / Kariya, Yoshiharu; Suga, Tadatomo.
In: Fatigue and Fracture of Engineering Materials and Structures, Vol. 30, No. 5, 05.2007, p. 413-419.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Low-cycle fatigue properties of eutectic solders at high temperatures
AU - Kariya, Yoshiharu
AU - Suga, Tadatomo
PY - 2007/5
Y1 - 2007/5
N2 - This paper details the deformation mechanism and low-cycle fatigue life of eutectic solder alloys at high temperature (around 0.8 Tm). Grain boundary sliding generally nucleates a wedge-type cavity that reduces the low-cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn-Ag-Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb-Sn and Bi-Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low-cycle fatigue endurance for theses eutectic Pb-Sn and Bi-Sn alloys.
AB - This paper details the deformation mechanism and low-cycle fatigue life of eutectic solder alloys at high temperature (around 0.8 Tm). Grain boundary sliding generally nucleates a wedge-type cavity that reduces the low-cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn-Ag-Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb-Sn and Bi-Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low-cycle fatigue endurance for theses eutectic Pb-Sn and Bi-Sn alloys.
KW - Creep
KW - Grain boundary sliding
KW - Lead-free solder
KW - Low-cycle fatigue
KW - Miniature testing
KW - Sn-3.0Ag-0.5Cu
KW - Sn-37Pb
KW - Sn-57Bi
UR - http://www.scopus.com/inward/record.url?scp=34247635676&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=34247635676&partnerID=8YFLogxK
U2 - 10.1111/j.1460-2695.2006.01091.x
DO - 10.1111/j.1460-2695.2006.01091.x
M3 - Article
AN - SCOPUS:34247635676
VL - 30
SP - 413
EP - 419
JO - Fatigue and Fracture of Engineering Materials and Structures
JF - Fatigue and Fracture of Engineering Materials and Structures
SN - 8756-758X
IS - 5
ER -