Low-cycle fatigue properties of eutectic solders at high temperatures

Yoshiharu Kariya; Tadatomo Suga

doi:10.1111/j.1460-2695.2006.01091.x

Low-cycle fatigue properties of eutectic solders at high temperatures

Yoshiharu Kariya, Tadatomo Suga

Research output: Contribution to journal › Article

19 Citations (Scopus)

Abstract

This paper details the deformation mechanism and low-cycle fatigue life of eutectic solder alloys at high temperature (around 0.8 T_m). Grain boundary sliding generally nucleates a wedge-type cavity that reduces the low-cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn-Ag-Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb-Sn and Bi-Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low-cycle fatigue endurance for theses eutectic Pb-Sn and Bi-Sn alloys.

Original language	English
Pages (from-to)	413-419
Number of pages	7
Journal	Fatigue and Fracture of Engineering Materials and Structures
Volume	30
Issue number	5
DOIs	https://doi.org/10.1111/j.1460-2695.2006.01091.x
Publication status	Published - 2007 May

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Keywords

Creep
Grain boundary sliding
Lead-free solder
Low-cycle fatigue
Miniature testing
Sn-3.0Ag-0.5Cu
Sn-37Pb
Sn-57Bi

ASJC Scopus subject areas

Mechanical Engineering
Materials Science(all)

Cite this

Kariya, Y., & Suga, T. (2007). Low-cycle fatigue properties of eutectic solders at high temperatures. Fatigue and Fracture of Engineering Materials and Structures, 30(5), 413-419. https://doi.org/10.1111/j.1460-2695.2006.01091.x

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Access to Document

10.1111/j.1460-2695.2006.01091.x