Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects

Yoshiharu Kariya, Takuya Hosoi, Takashi Kimura, Shinichi Terashima, Masamoto Tanaka

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

The straddle fatigue test has been performed to study the fatigue properties of Sn-1.2 mass%Ag-0.5 mass%Cu-0.05 mass%Ni for flip chip interconnections. The low cycle fatigue resistance of the alloy is equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-1 mass%Ag-0.5 mass%Cu alloy was poorer than that of the 3 mass%Ag alloy. The alloy has fine microstructure and Ag3Sn intermetallic compound makes a network structure together with fine (Cu.Ni)6Sn5 compound. The microstructure resulted in high cyclic strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.

Original languageEnglish
Pages (from-to)689-694
Number of pages6
JournalMaterials Transactions
Volume45
Issue number3
DOIs
Publication statusPublished - 2004 Mar

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Keywords

  • Ball grid Array (BGA) joints
  • Fatigue life
  • Flip chip
  • Lead-free solder
  • Low silver content
  • Nickel addition
  • Shear fatigue
  • Tin-silver-copper

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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