Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects

Yoshiharu Kariya, Takuya Hosoi, Takashi Kimura, Shinichi Terashima, Masamoto Tanaka

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

The straddle fatigue test has been performed to study the fatigue properties of Sn-1.2 mass%Ag-0.5 mass%Cu-0.05 mass%Ni for flip chip interconnections. The low cycle fatigue resistance of the alloy is equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-1 mass%Ag-0.5 mass%Cu alloy was poorer than that of the 3 mass%Ag alloy. The alloy has fine microstructure and Ag 3Sn intermetallic compound makes a network structure together with fine (Cu.Ni) 6Sn 5 compound. The microstructure resulted in high cyclic strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.

Original languageEnglish
Pages (from-to)689-694
Number of pages6
JournalMaterials Transactions
Volume45
Issue number3
Publication statusPublished - 2004 Mar
Externally publishedYes

Fingerprint

Silver
chips
silver
Fatigue of materials
cycles
endurance
Durability
microstructure
Microstructure
fatigue tests
strain hardening
Strain hardening
Intermetallics
intermetallics
exponents

Keywords

  • Ball grid Array (BGA) joints
  • Fatigue life
  • Flip chip
  • Lead-free solder
  • Low silver content
  • Nickel addition
  • Shear fatigue
  • Tin-silver-copper

ASJC Scopus subject areas

  • Materials Science(all)
  • Metals and Alloys

Cite this

Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects. / Kariya, Yoshiharu; Hosoi, Takuya; Kimura, Takashi; Terashima, Shinichi; Tanaka, Masamoto.

In: Materials Transactions, Vol. 45, No. 3, 03.2004, p. 689-694.

Research output: Contribution to journalArticle

Kariya, Y, Hosoi, T, Kimura, T, Terashima, S & Tanaka, M 2004, 'Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects', Materials Transactions, vol. 45, no. 3, pp. 689-694.
Kariya, Yoshiharu ; Hosoi, Takuya ; Kimura, Takashi ; Terashima, Shinichi ; Tanaka, Masamoto. / Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects. In: Materials Transactions. 2004 ; Vol. 45, No. 3. pp. 689-694.
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