Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects

Yoshiharu Kariya; Takuya Hosoi; Takashi Kimura; Shinichi Terashima; Masamoto Tanaka

doi:10.2320/matertrans.45.689

Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects

Yoshiharu Kariya, Takuya Hosoi, Takashi Kimura, Shinichi Terashima, Masamoto Tanaka

Research output: Contribution to journal › Article › peer-review

14 Citations (Scopus)

Abstract

The straddle fatigue test has been performed to study the fatigue properties of Sn-1.2 mass%Ag-0.5 mass%Cu-0.05 mass%Ni for flip chip interconnections. The low cycle fatigue resistance of the alloy is equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-1 mass%Ag-0.5 mass%Cu alloy was poorer than that of the 3 mass%Ag alloy. The alloy has fine microstructure and Ag₃Sn intermetallic compound makes a network structure together with fine (Cu.Ni)₆Sn₅ compound. The microstructure resulted in high cyclic strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.

Original language	English
Pages (from-to)	689-694
Number of pages	6
Journal	Materials Transactions
Volume	45
Issue number	3
DOIs	https://doi.org/10.2320/matertrans.45.689
Publication status	Published - 2004 Mar
Externally published	Yes

Keywords

Ball grid Array (BGA) joints
Fatigue life
Flip chip
Lead-free solder
Low silver content
Nickel addition
Shear fatigue
Tin-silver-copper

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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Cite this

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title = "Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects",

abstract = "The straddle fatigue test has been performed to study the fatigue properties of Sn-1.2 mass%Ag-0.5 mass%Cu-0.05 mass%Ni for flip chip interconnections. The low cycle fatigue resistance of the alloy is equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-1 mass%Ag-0.5 mass%Cu alloy was poorer than that of the 3 mass%Ag alloy. The alloy has fine microstructure and Ag3Sn intermetallic compound makes a network structure together with fine (Cu.Ni)6Sn5 compound. The microstructure resulted in high cyclic strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.",

keywords = "Ball grid Array (BGA) joints, Fatigue life, Flip chip, Lead-free solder, Low silver content, Nickel addition, Shear fatigue, Tin-silver-copper",

author = "Yoshiharu Kariya and Takuya Hosoi and Takashi Kimura and Shinichi Terashima and Masamoto Tanaka",

year = "2004",

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AU - Kariya, Yoshiharu

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AU - Kimura, Takashi

AU - Terashima, Shinichi

AU - Tanaka, Masamoto

PY - 2004/3

Y1 - 2004/3

N2 - The straddle fatigue test has been performed to study the fatigue properties of Sn-1.2 mass%Ag-0.5 mass%Cu-0.05 mass%Ni for flip chip interconnections. The low cycle fatigue resistance of the alloy is equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-1 mass%Ag-0.5 mass%Cu alloy was poorer than that of the 3 mass%Ag alloy. The alloy has fine microstructure and Ag3Sn intermetallic compound makes a network structure together with fine (Cu.Ni)6Sn5 compound. The microstructure resulted in high cyclic strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.

AB - The straddle fatigue test has been performed to study the fatigue properties of Sn-1.2 mass%Ag-0.5 mass%Cu-0.05 mass%Ni for flip chip interconnections. The low cycle fatigue resistance of the alloy is equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-1 mass%Ag-0.5 mass%Cu alloy was poorer than that of the 3 mass%Ag alloy. The alloy has fine microstructure and Ag3Sn intermetallic compound makes a network structure together with fine (Cu.Ni)6Sn5 compound. The microstructure resulted in high cyclic strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.

KW - Ball grid Array (BGA) joints

KW - Fatigue life

KW - Flip chip

KW - Lead-free solder

KW - Low silver content

KW - Nickel addition

KW - Shear fatigue

KW - Tin-silver-copper

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Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects

Abstract

Keywords

ASJC Scopus subject areas

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