Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects

Yoshiharu Kariya, Takuya Hosoi, Takashi Kimura, Shinichi Terashima, Masamoto Tanaka

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)

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Physics & Astronomy

Engineering & Materials Science

Chemical Compounds