Abstract
Micro-bulk fatigue testing was developed to investigate the fatigue lives and damage mechanisms of Sn-3.0Ag-0.5Cu and Sn-37Pb solder alloys. The fatigue lives of micro-bulk solder obeyed Manson-Coffin's empirical law, and the fatigue ductility exponents were about 0.55 for both Sn-Ag-Cu and Sn-Pb alloys. The fatigue life of Sn-3.0Ag-0.5Cu alloy was 10 times longer than that of Sn-37Pb alloy under symmetrical wave profile, although fatigue resistance of Sn-3.0Ag-0.5Cu alloy was not so superior under asymmetrical wave condition. The fatigue crack was developed from extrusion and intrusion of slip band in Sn-3.0Ag-0.5Cu alloy, while the crack was observed at colony boundary in Sn-37Pb alloy. The difference in damage mechanism may affect the sensitivity of fatigue life to reversibility of loading profile.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 |
| Pages | 1827-1832 |
| Number of pages | 6 |
| Volume | PART C |
| Publication status | Published - 2006 |
| Externally published | Yes |
| Event | ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA Duration: 2005 Jul 17 → 2005 Jul 22 |
Other
| Other | ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 |
|---|---|
| City | San Francisco, CA |
| Period | 05/7/17 → 05/7/22 |
Fingerprint
Keywords
- Crack initiation
- Damage mechanism
- Fatigue life
- Lead-free solder
- Micro-bulk
- Miniature testing
- Sn-Ag-Cu
- Sn-Pb
- Solder
ASJC Scopus subject areas
- Engineering(all)
Cite this
Low cycle fatigue properties of solder alloys evaluated by micro bulk specimen. / Kariya, Yoshiharu; Suga, Tadatomo; Niimi, Tomokazu; Otsuka, Masahisa.
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C 2006. p. 1827-1832.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Low cycle fatigue properties of solder alloys evaluated by micro bulk specimen
AU - Kariya, Yoshiharu
AU - Suga, Tadatomo
AU - Niimi, Tomokazu
AU - Otsuka, Masahisa
PY - 2006
Y1 - 2006
N2 - Micro-bulk fatigue testing was developed to investigate the fatigue lives and damage mechanisms of Sn-3.0Ag-0.5Cu and Sn-37Pb solder alloys. The fatigue lives of micro-bulk solder obeyed Manson-Coffin's empirical law, and the fatigue ductility exponents were about 0.55 for both Sn-Ag-Cu and Sn-Pb alloys. The fatigue life of Sn-3.0Ag-0.5Cu alloy was 10 times longer than that of Sn-37Pb alloy under symmetrical wave profile, although fatigue resistance of Sn-3.0Ag-0.5Cu alloy was not so superior under asymmetrical wave condition. The fatigue crack was developed from extrusion and intrusion of slip band in Sn-3.0Ag-0.5Cu alloy, while the crack was observed at colony boundary in Sn-37Pb alloy. The difference in damage mechanism may affect the sensitivity of fatigue life to reversibility of loading profile.
AB - Micro-bulk fatigue testing was developed to investigate the fatigue lives and damage mechanisms of Sn-3.0Ag-0.5Cu and Sn-37Pb solder alloys. The fatigue lives of micro-bulk solder obeyed Manson-Coffin's empirical law, and the fatigue ductility exponents were about 0.55 for both Sn-Ag-Cu and Sn-Pb alloys. The fatigue life of Sn-3.0Ag-0.5Cu alloy was 10 times longer than that of Sn-37Pb alloy under symmetrical wave profile, although fatigue resistance of Sn-3.0Ag-0.5Cu alloy was not so superior under asymmetrical wave condition. The fatigue crack was developed from extrusion and intrusion of slip band in Sn-3.0Ag-0.5Cu alloy, while the crack was observed at colony boundary in Sn-37Pb alloy. The difference in damage mechanism may affect the sensitivity of fatigue life to reversibility of loading profile.
KW - Crack initiation
KW - Damage mechanism
KW - Fatigue life
KW - Lead-free solder
KW - Micro-bulk
KW - Miniature testing
KW - Sn-Ag-Cu
KW - Sn-Pb
KW - Solder
UR - http://www.scopus.com/inward/record.url?scp=32844459252&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=32844459252&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:32844459252
SN - 0791842002
VL - PART C
SP - 1827
EP - 1832
BT - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
ER -