Low cycle fatigue properties of solder alloys evaluated by micro bulk specimen

Yoshiharu Kariya, Tadatomo Suga, Tomokazu Niimi, Masahisa Otsuka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Micro-bulk fatigue testing was developed to investigate the fatigue lives and damage mechanisms of Sn-3.0Ag-0.5Cu and Sn-37Pb solder alloys. The fatigue lives of micro-bulk solder obeyed Manson-Coffin's empirical law, and the fatigue ductility exponents were about 0.55 for both Sn-Ag-Cu and Sn-Pb alloys. The fatigue life of Sn-3.0Ag-0.5Cu alloy was 10 times longer than that of Sn-37Pb alloy under symmetrical wave profile, although fatigue resistance of Sn-3.0Ag-0.5Cu alloy was not so superior under asymmetrical wave condition. The fatigue crack was developed from extrusion and intrusion of slip band in Sn-3.0Ag-0.5Cu alloy, while the crack was observed at colony boundary in Sn-37Pb alloy. The difference in damage mechanism may affect the sensitivity of fatigue life to reversibility of loading profile.

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Pages1827-1832
Number of pages6
VolumePART C
Publication statusPublished - 2006
Externally publishedYes
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA
Duration: 2005 Jul 172005 Jul 22

Other

OtherASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
CitySan Francisco, CA
Period05/7/1705/7/22

Fingerprint

Soldering alloys
Fatigue of materials
Fatigue testing
Fatigue damage
Extrusion
Ductility
Cracks

Keywords

  • Crack initiation
  • Damage mechanism
  • Fatigue life
  • Lead-free solder
  • Micro-bulk
  • Miniature testing
  • Sn-Ag-Cu
  • Sn-Pb
  • Solder

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Kariya, Y., Suga, T., Niimi, T., & Otsuka, M. (2006). Low cycle fatigue properties of solder alloys evaluated by micro bulk specimen. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 (Vol. PART C, pp. 1827-1832)

Low cycle fatigue properties of solder alloys evaluated by micro bulk specimen. / Kariya, Yoshiharu; Suga, Tadatomo; Niimi, Tomokazu; Otsuka, Masahisa.

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C 2006. p. 1827-1832.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kariya, Y, Suga, T, Niimi, T & Otsuka, M 2006, Low cycle fatigue properties of solder alloys evaluated by micro bulk specimen. in Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. vol. PART C, pp. 1827-1832, ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, San Francisco, CA, 05/7/17.
Kariya Y, Suga T, Niimi T, Otsuka M. Low cycle fatigue properties of solder alloys evaluated by micro bulk specimen. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C. 2006. p. 1827-1832
Kariya, Yoshiharu ; Suga, Tadatomo ; Niimi, Tomokazu ; Otsuka, Masahisa. / Low cycle fatigue properties of solder alloys evaluated by micro bulk specimen. Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C 2006. pp. 1827-1832
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