@inproceedings{fd02709023d8446b8a1f09693d8d286a,
title = "Low cycle fatigue properties of solder alloys evaluated by micro bulk specimen",
abstract = "Micro-bulk fatigue testing was developed to investigate the fatigue lives and damage mechanisms of Sn-3.0Ag-0.5Cu and Sn-37Pb solder alloys. The fatigue lives of micro-bulk solder obeyed Manson-Coffin's empirical law, and the fatigue ductility exponents were about 0.55 for both Sn-Ag-Cu and Sn-Pb alloys. The fatigue life of Sn-3.0Ag-0.5Cu alloy was 10 times longer than that of Sn-37Pb alloy under symmetrical wave profile, although fatigue resistance of Sn-3.0Ag-0.5Cu alloy was not so superior under asymmetrical wave condition. The fatigue crack was developed from extrusion and intrusion of slip band in Sn-3.0Ag-0.5Cu alloy, while the crack was observed at colony boundary in Sn-37Pb alloy. The difference in damage mechanism may affect the sensitivity of fatigue life to reversibility of loading profile.",
keywords = "Crack initiation, Damage mechanism, Fatigue life, Lead-free solder, Micro-bulk, Miniature testing, Sn-Ag-Cu, Sn-Pb, Solder",
author = "Yoshiharu Kariya and Tadatomo Suga and Tomokazu Niimi and Masahisa Otsuka",
year = "2006",
month = feb,
day = "23",
language = "English",
isbn = "0791842002",
series = "Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005",
pages = "1827--1832",
booktitle = "Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems",
note = "ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 ; Conference date: 17-07-2005 Through 22-07-2005",
}