Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

Kazuki Watanabe, Yoshiharu Kariya, Naoyuki Yajima, Kizuku Obinata, Yoshiyuki Hiroshima, Shunichi Kikuchi, Akiko Matsui, Hiroshi Shimizu

Research output: Contribution to journalArticle

3 Citations (Scopus)


A new fatigue test method was proposed for low-cycle fatigue lives of electroplated copper thin films for the through hole (TH) in a printed wiring board. And the low-cycle fatigue lives were investigated according to the proposed method. Furthermore, thermal stress analysis of the TH with the finite element method was performed to predict thermal fatigue life of the TH based on Manson-Coffin law for electroplated copper thin films obtained from the low-cycle fatigue test. Low-cycle fatigue damage in the electroplated copper thin film was occurring in the grain boundaries and the damage mechanism was found same as that for thermal fatigue damage in TH in the printed wiring board. And the fatigue life of TH predicted from the Manson-Coffin law at the maximum temperature of thermal fatigue test was good agreement with the thermal fatigue life obtained from the experimental result of thermal fatigue test.

Original languageEnglish
Pages (from-to)20-27
Number of pages8
JournalMicroelectronics Reliability
Publication statusPublished - 2018 Mar 1



  • Electroplated copper thin film
  • Fatigue failure mechanism
  • FEM
  • Low-cycle fatigue
  • Printed wiring board
  • Temperature dependence
  • Thermal fatigue
  • Through hole via

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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