Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

Kazuki Watanabe, Yoshiharu Kariya, Naoyuki Yajima, Kizuku Obinata, Yoshiyuki Hiroshima, Shunichi Kikuchi, Akiko Matsui, Hiroshi Shimizu

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10 Citations (Scopus)

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