Low Dielectric Comstant Materials and Methods for Interlayer Dielectric Films in Ultra-large-scale Integrated Circuit Multilevel Interconnection

Research output: Contribution to journalArticle

110 Citations (Scopus)
Original languageEnglish
Pages (from-to)243-285
JournalJournal of Material Science and Technology, R
VolumeR23
Publication statusPublished - 1998 Sep 16

Cite this

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title = "Low Dielectric Comstant Materials and Methods for Interlayer Dielectric Films in Ultra-large-scale Integrated Circuit Multilevel Interconnection",
author = "T. Homma",
year = "1998",
month = "9",
day = "16",
language = "English",
volume = "R23",
pages = "243--285",
journal = "Journal of Material Science and Technology, R",

}

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T1 - Low Dielectric Comstant Materials and Methods for Interlayer Dielectric Films in Ultra-large-scale Integrated Circuit Multilevel Interconnection

AU - Homma, T.

PY - 1998/9/16

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VL - R23

SP - 243

EP - 285

JO - Journal of Material Science and Technology, R

JF - Journal of Material Science and Technology, R

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