Low Dielectric Comstant Materials and Methods for Interlayer Dielectric Films in Ultra-large-scale Integrated Circuit Multilevel Interconnection

T. Homma

Low Dielectric Comstant Materials and Methods for Interlayer Dielectric Films in Ultra-large-scale Integrated Circuit Multilevel Interconnection

Functional Control Systems

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	243-285
Journal	Journal of Material Science and Technology, R
Volume	R23
Publication status	Published - 1998 Sept 16

Cite this

@article{b5dfbd18b7604ebc9b1add372a9b9729,

title = "Low Dielectric Comstant Materials and Methods for Interlayer Dielectric Films in Ultra-large-scale Integrated Circuit Multilevel Interconnection",

author = "T. Homma",

year = "1998",

month = sep,

day = "16",

language = "English",

volume = "R23",

pages = "243--285",

journal = "Journal of Material Science and Technology, R",

}