Low Dielectric Comstant Materials and Methods for Interlayer Dielectric Films in Ultra-large-scale Integrated Circuit Multilevel Interconnection

Research output: Contribution to journalArticlepeer-review

112 Citations (Scopus)
Original languageEnglish
Pages (from-to)243-285
JournalJournal of Material Science and Technology, R
VolumeR23
Publication statusPublished - 1998 Sep 16

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