Low-impedance evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system

Katsuya Kikuchi, Chihiro Ueda, Koichi Takemura, Osamu Shimada, Toshio Gomyo, Yukiharu Takeuchi, Toshikazu Ookubo, Kazuhiro Baba, Masahiro Aoyagi, Toshio Sudo, Kanji Otsuka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

16 Citations (Scopus)

Abstract

We evaluated low-impedance power distribution network (PDN) of decoupling capacitor embedded interposers for 3-D integrated LSI system. Measurements are carried out using the developed impedance analyzer system of a wide frequency range for evaluating ultralow impedance, and calculations are carried out using 2.5-D finite element method (FEM) electromagnetic field simulator. We fabricated various types of capacitor mounted or capacitor embedded interposers test element group (TEG), such as surfacemounted and embedded chip capacitors, and thin film capacitors on silicon interposers using the same simple design to compare measurement results with calculation ones. As a result, the chip capacitor embedded organic interposer TEG and thin film capacitor embedded silicon interposer TEG could provide low PDN impedance at a wide frequency range of up to 40 GHz. In particular, the interposer TEGs of the thin film capacitor embedded interposer that shows a low impedance of 0.1Ωcould be evaluated and calculated accurately. By using chip capacitor embedded or thin film capacitor embedded interposers for 3-D integrated LSI system, it is expected that the PDN of the system can be achieved ultralow PDN impedance.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages1455-1460
Number of pages6
DOIs
Publication statusPublished - 2010
Event60th Electronic Components and Technology Conference, ECTC 2010 - Las Vegas, NV
Duration: 2010 Jun 12010 Jun 4

Other

Other60th Electronic Components and Technology Conference, ECTC 2010
CityLas Vegas, NV
Period10/6/110/6/4

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Electric power distribution
Capacitors
Silicon
Electromagnetic fields
Simulators
Finite element method
Film capacitor

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Kikuchi, K., Ueda, C., Takemura, K., Shimada, O., Gomyo, T., Takeuchi, Y., ... Otsuka, K. (2010). Low-impedance evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system. In Proceedings - Electronic Components and Technology Conference (pp. 1455-1460). [5490807] https://doi.org/10.1109/ECTC.2010.5490807

Low-impedance evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system. / Kikuchi, Katsuya; Ueda, Chihiro; Takemura, Koichi; Shimada, Osamu; Gomyo, Toshio; Takeuchi, Yukiharu; Ookubo, Toshikazu; Baba, Kazuhiro; Aoyagi, Masahiro; Sudo, Toshio; Otsuka, Kanji.

Proceedings - Electronic Components and Technology Conference. 2010. p. 1455-1460 5490807.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kikuchi, K, Ueda, C, Takemura, K, Shimada, O, Gomyo, T, Takeuchi, Y, Ookubo, T, Baba, K, Aoyagi, M, Sudo, T & Otsuka, K 2010, Low-impedance evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system. in Proceedings - Electronic Components and Technology Conference., 5490807, pp. 1455-1460, 60th Electronic Components and Technology Conference, ECTC 2010, Las Vegas, NV, 10/6/1. https://doi.org/10.1109/ECTC.2010.5490807
Kikuchi K, Ueda C, Takemura K, Shimada O, Gomyo T, Takeuchi Y et al. Low-impedance evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system. In Proceedings - Electronic Components and Technology Conference. 2010. p. 1455-1460. 5490807 https://doi.org/10.1109/ECTC.2010.5490807
Kikuchi, Katsuya ; Ueda, Chihiro ; Takemura, Koichi ; Shimada, Osamu ; Gomyo, Toshio ; Takeuchi, Yukiharu ; Ookubo, Toshikazu ; Baba, Kazuhiro ; Aoyagi, Masahiro ; Sudo, Toshio ; Otsuka, Kanji. / Low-impedance evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system. Proceedings - Electronic Components and Technology Conference. 2010. pp. 1455-1460
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