Low-impedance evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system

Katsuya Kikuchi, Chihiro Ueda, Koichi Takemura, Osamu Shimada, Toshio Gomyo, Yukiharu Takeuchi, Toshikazu Ookubo, Kazuhiro Baba, Masahiro Aoyagi, Toshio Sudo, Kanji Otsuka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

17 Citations (Scopus)

Abstract

We evaluated low-impedance power distribution network (PDN) of decoupling capacitor embedded interposers for 3-D integrated LSI system. Measurements are carried out using the developed impedance analyzer system of a wide frequency range for evaluating ultralow impedance, and calculations are carried out using 2.5-D finite element method (FEM) electromagnetic field simulator. We fabricated various types of capacitor mounted or capacitor embedded interposers test element group (TEG), such as surfacemounted and embedded chip capacitors, and thin film capacitors on silicon interposers using the same simple design to compare measurement results with calculation ones. As a result, the chip capacitor embedded organic interposer TEG and thin film capacitor embedded silicon interposer TEG could provide low PDN impedance at a wide frequency range of up to 40 GHz. In particular, the interposer TEGs of the thin film capacitor embedded interposer that shows a low impedance of 0.1Ωcould be evaluated and calculated accurately. By using chip capacitor embedded or thin film capacitor embedded interposers for 3-D integrated LSI system, it is expected that the PDN of the system can be achieved ultralow PDN impedance.

Original languageEnglish
Title of host publication2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010
Pages1455-1460
Number of pages6
DOIs
Publication statusPublished - 2010 Aug 9
Event60th Electronic Components and Technology Conference, ECTC 2010 - Las Vegas, NV, United States
Duration: 2010 Jun 12010 Jun 4

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference60th Electronic Components and Technology Conference, ECTC 2010
CountryUnited States
CityLas Vegas, NV
Period10/6/110/6/4

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Kikuchi, K., Ueda, C., Takemura, K., Shimada, O., Gomyo, T., Takeuchi, Y., Ookubo, T., Baba, K., Aoyagi, M., Sudo, T., & Otsuka, K. (2010). Low-impedance evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system. In 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010 (pp. 1455-1460). [5490807] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2010.5490807