Low-impedance power distribution network of decoupling capacitor embedded interposers for 3-D integrated LSI system

Katsuya Kikuchi, Koichi Takemura, Chihiro Ueda, Osamu Shimada, Toshio Gomyo, Yukiharu Takeuchi, Toshikazu Okubo, Kazuhiro Baba, Masahiro Aoyagi, Toshio Sudo, Kanji Otsuka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

We evaluated low-impedance power distribution network (PDN) of decoupling capacitor embedded interposers for 3-D integrated LSI system. Measurements are carried out using the developed impedance analyzer system of a wide frequency range for evaluating ultralow impedance, and calculations are carried out using 2.5-D finite element method (FEM) electromagnetic field simulator. We fabricated various types of capacitor mounted or capacitor embedded interposers test element group (TEG), such as surface-mounted and embedded chip capacitors, and thin film capacitors on silicon interposers using the same simple design to compare measurement results with calculation ones. As a result, the chip capacitor embedded organic interposer TEG and thin film capacitor embedded silicon interposer TEG could provide low PDN impedance at a wide frequency range of up to 10 GHz. In particular, the interposer TEGs of the thin film capacitor embedded interposer that shows a low impedance of approximately 0.001 ? could be evaluated and calculated accurately. By using chip capacitor embedded or thin film capacitor embedded interposers for 3-D integrated LSI system, it is expected that the PDN of the system can be achieved ultralow PDN impedance.

Original languageEnglish
Title of host publication2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09
Pages25-28
Number of pages4
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09 - Portland, OR, United States
Duration: 2009 Oct 192009 Oct 21

Publication series

Name2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09

Conference

Conference2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09
CountryUnited States
CityPortland, OR
Period09/10/1909/10/21

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ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Kikuchi, K., Takemura, K., Ueda, C., Shimada, O., Gomyo, T., Takeuchi, Y., Okubo, T., Baba, K., Aoyagi, M., Sudo, T., & Otsuka, K. (2009). Low-impedance power distribution network of decoupling capacitor embedded interposers for 3-D integrated LSI system. In 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09 (pp. 25-28). [5338487] (2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09). https://doi.org/10.1109/EPEPS.2009.5338487