Low resistance copper via technology (Invited)

K.Ueno K.Ueno, V.M.Donnelly V.M.Donnelly, Y.Tsuchiya Y.Tsuchiya, H.Aoki H.Aoki, Kazuyoshi Ueno

Research output: Contribution to journalArticle

Original languageEnglish
JournalAbstract of Symposium on Advanced Interconnects and Contacts
Publication statusPublished - 1999 Apr 5

Cite this

K.Ueno, K. U., V.M.Donnelly, V. M. D., Y.Tsuchiya, Y. T., H.Aoki, H. A., & Ueno, K. (1999). Low resistance copper via technology (Invited). Abstract of Symposium on Advanced Interconnects and Contacts.

Low resistance copper via technology (Invited). / K.Ueno, K.Ueno; V.M.Donnelly, V.M.Donnelly; Y.Tsuchiya, Y.Tsuchiya; H.Aoki, H.Aoki; Ueno, Kazuyoshi.

In: Abstract of Symposium on Advanced Interconnects and Contacts, 05.04.1999.

Research output: Contribution to journalArticle

K.Ueno, K.Ueno ; V.M.Donnelly, V.M.Donnelly ; Y.Tsuchiya, Y.Tsuchiya ; H.Aoki, H.Aoki ; Ueno, Kazuyoshi. / Low resistance copper via technology (Invited). In: Abstract of Symposium on Advanced Interconnects and Contacts. 1999.
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