Master-slice 3D MMIC

Tsuneo Tokumitsu, Makoto Hirano, Ichihiko Toyoda, Kenjiro Nishikawa, Chikara Yamaguchi, Masayoshi Aikawa

    Research output: Contribution to journalArticlepeer-review

    Abstract

    NTT has developed a novel Master-Slice three-dimensional MMIC technology involving the masterslice concept in the 3D MMIC structure. This technology enables the fabrication of high-density, microwave and millimeter-wave semicustom MMICs that was unsuccessful in conventional planar MMICs. Areas of around 2 × 2 mm, each of which has transistors, resistors and capacitor electrodes closely located, are fabricated in advance over a masterslice wafer, and each area is selectively covered by ground metal to create a space wide enough for the 3D circuits stacked above it. Using this methodology, we achieved a turn-around-time half that of conventional MMICs. This technology is also applied successfully to low-cost Si wafers. Hence, the technology shows excellent potential for more widespread application of MMICs.

    Original languageEnglish
    Pages (from-to)1293-1299
    Number of pages7
    JournalNTT R and D
    Volume45
    Issue number12
    Publication statusPublished - 1996 Dec 1

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

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