Measurement and analysis of SSN and Jitter of FPGA

Haruya Fujita, Yo Iijima, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Parasitic inductance that exists in a package induces SSN (Simultaneous Switching Noise) and timing jitter. These noises cause malfunction of LSI and systems. The goal of this paper is to clarify the influence of the effective inductance of the package including mutual inductance by changing the number of simultaneously switching buffers and alternating adjacent buffers in the reverse direction each other. In this study, measured SSNs were reproduced by HSPICE simulation. The whole simulation model consisted of on-chip PDN (Power Distribution Network), package PDN and board PDN, along with I/O buffer model. The simulated SSN waveforms agreed well with the measured results.

Original languageEnglish
Title of host publicationIEEE International Symposium on Electromagnetic Compatibility
DOIs
Publication statusPublished - 2012
EventInternational Symposium on Electromagnetic Compatibility, EMC EUROPE 2012 - Rome
Duration: 2012 Sep 172012 Sep 21

Other

OtherInternational Symposium on Electromagnetic Compatibility, EMC EUROPE 2012
CityRome
Period12/9/1712/9/21

Fingerprint

Jitter
Electric power distribution
inductance
Inductance
Field programmable gate arrays (FPGA)
buffers
vibration
Timing jitter
malfunctions
large scale integration
waveforms
simulation
chips
time measurement
causes

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Fujita, H., Iijima, Y., & Sudo, T. (2012). Measurement and analysis of SSN and Jitter of FPGA. In IEEE International Symposium on Electromagnetic Compatibility [6396872] https://doi.org/10.1109/EMCEurope.2012.6396872

Measurement and analysis of SSN and Jitter of FPGA. / Fujita, Haruya; Iijima, Yo; Sudo, Toshio.

IEEE International Symposium on Electromagnetic Compatibility. 2012. 6396872.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fujita, H, Iijima, Y & Sudo, T 2012, Measurement and analysis of SSN and Jitter of FPGA. in IEEE International Symposium on Electromagnetic Compatibility., 6396872, International Symposium on Electromagnetic Compatibility, EMC EUROPE 2012, Rome, 12/9/17. https://doi.org/10.1109/EMCEurope.2012.6396872
Fujita H, Iijima Y, Sudo T. Measurement and analysis of SSN and Jitter of FPGA. In IEEE International Symposium on Electromagnetic Compatibility. 2012. 6396872 https://doi.org/10.1109/EMCEurope.2012.6396872
Fujita, Haruya ; Iijima, Yo ; Sudo, Toshio. / Measurement and analysis of SSN and Jitter of FPGA. IEEE International Symposium on Electromagnetic Compatibility. 2012.
@inproceedings{e8c291c358e94b19ab3c553599e5f427,
title = "Measurement and analysis of SSN and Jitter of FPGA",
abstract = "Parasitic inductance that exists in a package induces SSN (Simultaneous Switching Noise) and timing jitter. These noises cause malfunction of LSI and systems. The goal of this paper is to clarify the influence of the effective inductance of the package including mutual inductance by changing the number of simultaneously switching buffers and alternating adjacent buffers in the reverse direction each other. In this study, measured SSNs were reproduced by HSPICE simulation. The whole simulation model consisted of on-chip PDN (Power Distribution Network), package PDN and board PDN, along with I/O buffer model. The simulated SSN waveforms agreed well with the measured results.",
author = "Haruya Fujita and Yo Iijima and Toshio Sudo",
year = "2012",
doi = "10.1109/EMCEurope.2012.6396872",
language = "English",
isbn = "9781467307185",
booktitle = "IEEE International Symposium on Electromagnetic Compatibility",

}

TY - GEN

T1 - Measurement and analysis of SSN and Jitter of FPGA

AU - Fujita, Haruya

AU - Iijima, Yo

AU - Sudo, Toshio

PY - 2012

Y1 - 2012

N2 - Parasitic inductance that exists in a package induces SSN (Simultaneous Switching Noise) and timing jitter. These noises cause malfunction of LSI and systems. The goal of this paper is to clarify the influence of the effective inductance of the package including mutual inductance by changing the number of simultaneously switching buffers and alternating adjacent buffers in the reverse direction each other. In this study, measured SSNs were reproduced by HSPICE simulation. The whole simulation model consisted of on-chip PDN (Power Distribution Network), package PDN and board PDN, along with I/O buffer model. The simulated SSN waveforms agreed well with the measured results.

AB - Parasitic inductance that exists in a package induces SSN (Simultaneous Switching Noise) and timing jitter. These noises cause malfunction of LSI and systems. The goal of this paper is to clarify the influence of the effective inductance of the package including mutual inductance by changing the number of simultaneously switching buffers and alternating adjacent buffers in the reverse direction each other. In this study, measured SSNs were reproduced by HSPICE simulation. The whole simulation model consisted of on-chip PDN (Power Distribution Network), package PDN and board PDN, along with I/O buffer model. The simulated SSN waveforms agreed well with the measured results.

UR - http://www.scopus.com/inward/record.url?scp=84872516178&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84872516178&partnerID=8YFLogxK

U2 - 10.1109/EMCEurope.2012.6396872

DO - 10.1109/EMCEurope.2012.6396872

M3 - Conference contribution

SN - 9781467307185

BT - IEEE International Symposium on Electromagnetic Compatibility

ER -