Measurement of Crack Tip Displacement Field in Desiccating Paste

Tatsuya Arai, Kenichi Sakaue

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Desiccation cracking is a phenomenon in which cracks are caused by shrinkage of drying paste material. In the present study, digital image correlation, DIC, is applied to measure the displacement field at the crack tip in a drying paste. In order to obtain magnified images around the crack tip, the control method for crack nucleation position and crack propagation direction is newly developed. Furthermore, stress intensity factors are evaluated by iterative procedure from the measured displacement field. The results show that the stress intensity factors are varied during crack propagation because of kinked crack path ant the fracture toughness depends on the paste thickness even the paste is composed of the same powder. In addition, it is found that the fracture toughness is independent of the crack propagation speed. The dependence of the fracture toughness on the paste thickness is noticeable results to analyze the fracture of desiccation cracking.

Original languageEnglish
Title of host publicationFracture, Fatigue, Failure, and Damage Evolution - Proceedings of the 2014 Annual Conference on Experimental and Applied Mechanics
PublisherSpringer New York LLC
Pages67-72
Number of pages6
EditionVOLUME 5
ISBN (Print)9783319069760
DOIs
Publication statusPublished - 2015 Jan 1
Event2014 SEM Annual Conference and Exposition on Experimental and Applied Mechanics - Greenville, SC, United States
Duration: 2014 Jun 22014 Jun 5

Publication series

NameConference Proceedings of the Society for Experimental Mechanics Series
NumberVOLUME 5
Volume66
ISSN (Print)2191-5644
ISSN (Electronic)2191-5652

Conference

Conference2014 SEM Annual Conference and Exposition on Experimental and Applied Mechanics
CountryUnited States
CityGreenville, SC
Period14/6/214/6/5

Keywords

  • Desiccation cracking
  • Digital image correlation
  • Fracture mechanics
  • Paste material
  • Stress intensity factor

ASJC Scopus subject areas

  • Engineering(all)
  • Computational Mechanics
  • Mechanical Engineering

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