Mechanical characteristics of lead-free solder alloys in small volume

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)368-374
Number of pages7
JournalJournal of Japan Institute of Electronics Packaging
Volume11
Issue number5
DOIs
Publication statusPublished - 2008 Aug

Fingerprint

Lead-free solders

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Mechanical characteristics of lead-free solder alloys in small volume. / Kariya, Yoshiharu.

In: Journal of Japan Institute of Electronics Packaging, Vol. 11, No. 5, 08.2008, p. 368-374.

Research output: Contribution to journalArticle

@article{4c10cf057a42401bb4545255409bec24,
title = "Mechanical characteristics of lead-free solder alloys in small volume",
author = "Yoshiharu Kariya",
year = "2008",
month = "8",
doi = "10.5104/jiep.11.368",
language = "English",
volume = "11",
pages = "368--374",
journal = "Journal of Japan Institute of Electronics Packaging",
issn = "1343-9677",
publisher = "The Japan Institute of Electronics Packaging",
number = "5",

}

TY - JOUR

T1 - Mechanical characteristics of lead-free solder alloys in small volume

AU - Kariya, Yoshiharu

PY - 2008/8

Y1 - 2008/8

UR - http://www.scopus.com/inward/record.url?scp=84871096964&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84871096964&partnerID=8YFLogxK

U2 - 10.5104/jiep.11.368

DO - 10.5104/jiep.11.368

M3 - Article

VL - 11

SP - 368

EP - 374

JO - Journal of Japan Institute of Electronics Packaging

JF - Journal of Japan Institute of Electronics Packaging

SN - 1343-9677

IS - 5

ER -