Mechanical characteristics of lead-free solder alloys in small volume

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	368-374
Number of pages	7
Journal	Journal of Japan Institute of Electronics Packaging
Volume	11
Issue number	5
DOIs	https://doi.org/10.5104/jiep.11.368
Publication status	Published - 2008 Aug

ASJC Scopus subject areas

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title = "Mechanical characteristics of lead-free solder alloys in small volume",

author = "Yoshiharu Kariya",

year = "2008",

month = aug,

doi = "10.5104/jiep.11.368",

language = "English",

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