Mechanical characteristics of lead-free solder alloys in small volume

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)368-374
Number of pages7
JournalJournal of Japan Institute of Electronics Packaging
Volume11
Issue number5
DOIs
Publication statusPublished - 2008 Aug 1

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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