Mechanical Fatigue Characteristics of Sn-3.5mass%Ag-X(X=Bi, Cu, Zn and In) Solder Alloys

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	1229-1235
Journal	Journal of Electronic Materials
Volume	27
Publication status	Published - 1998 Jul 1

Cite this

@article{5a75d7804b144fbb8473c368f71cc332,

title = "Mechanical Fatigue Characteristics of Sn-3.5mass%Ag-X(X=Bi, Cu, Zn and In) Solder Alloys",

author = "Yoshiharu Kariya and Masahisa Otsuka",

year = "1998",

month = jul,

day = "1",

language = "English",

volume = "27",

pages = "1229--1235",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

}