Mechanical properties of lead-free solder alloys evaluated by miniature size specimen

Yoshiharu Kariya, Tsuyoshi Asai, Tadatomo Suga

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Tensile and fatigue testing using miniature specimen was proposed to compare the mechanical behaviors of Sn-3.0%Ag-0.5%Cu alloy in small and large volumes respectively. It was found that the tensile strength data of the miniature specimen was not similar with clear inferiority to that of the large volume under all test conditions. The differences in their mechanical properties are attributed to dendrite morphology and intermetallic compounds size. Thus, the mechanical behavior and the solidification microstructure strongly depend on specimen volume, which suggests that small size be used to measure mechanical behaviors of solder alloys.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsC. Quan, F.S. Chau, A. Asundi, B.S. Wong, C.T. Lim
Pages297-301
Number of pages5
Volume5852 PART I
DOIs
Publication statusPublished - 2005
Externally publishedYes
EventThird International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics - Singapore, Singapore
Duration: 2004 Nov 292004 Dec 1

Other

OtherThird International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
CountrySingapore
CitySingapore
Period04/11/2904/12/1

Fingerprint

solders
mechanical properties
Mechanical properties
Dendrites (metallography)
Fatigue testing
Tensile testing
Soldering alloys
Intermetallics
Solidification
Tensile strength
dendrites
tensile strength
solidification
Microstructure
intermetallics
microstructure
Lead-free solders

Keywords

  • Fatigue
  • Lead-free solder
  • Mechanical properties
  • Microstructure
  • Miniature testing
  • Sn-3.0Ag-0.5Cu

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Kariya, Y., Asai, T., & Suga, T. (2005). Mechanical properties of lead-free solder alloys evaluated by miniature size specimen. In C. Quan, F. S. Chau, A. Asundi, B. S. Wong, & C. T. Lim (Eds.), Proceedings of SPIE - The International Society for Optical Engineering (Vol. 5852 PART I, pp. 297-301). [48] https://doi.org/10.1117/12.621538

Mechanical properties of lead-free solder alloys evaluated by miniature size specimen. / Kariya, Yoshiharu; Asai, Tsuyoshi; Suga, Tadatomo.

Proceedings of SPIE - The International Society for Optical Engineering. ed. / C. Quan; F.S. Chau; A. Asundi; B.S. Wong; C.T. Lim. Vol. 5852 PART I 2005. p. 297-301 48.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kariya, Y, Asai, T & Suga, T 2005, Mechanical properties of lead-free solder alloys evaluated by miniature size specimen. in C Quan, FS Chau, A Asundi, BS Wong & CT Lim (eds), Proceedings of SPIE - The International Society for Optical Engineering. vol. 5852 PART I, 48, pp. 297-301, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, Singapore, Singapore, 04/11/29. https://doi.org/10.1117/12.621538
Kariya Y, Asai T, Suga T. Mechanical properties of lead-free solder alloys evaluated by miniature size specimen. In Quan C, Chau FS, Asundi A, Wong BS, Lim CT, editors, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 5852 PART I. 2005. p. 297-301. 48 https://doi.org/10.1117/12.621538
Kariya, Yoshiharu ; Asai, Tsuyoshi ; Suga, Tadatomo. / Mechanical properties of lead-free solder alloys evaluated by miniature size specimen. Proceedings of SPIE - The International Society for Optical Engineering. editor / C. Quan ; F.S. Chau ; A. Asundi ; B.S. Wong ; C.T. Lim. Vol. 5852 PART I 2005. pp. 297-301
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