Abstract
Tensile and fatigue testing using miniature specimen was proposed to compare the mechanical behaviors of Sn-3.0%Ag-0.5%Cu alloy in small and large volumes respectively. It was found that the tensile strength data of the miniature specimen was not similar with clear inferiority to that of the large volume under all test conditions. The differences in their mechanical properties are attributed to dendrite morphology and intermetallic compounds size. Thus, the mechanical behavior and the solidification microstructure strongly depend on specimen volume, which suggests that small size be used to measure mechanical behaviors of solder alloys.
| Original language | English |
|---|---|
| Article number | 48 |
| Pages (from-to) | 297-301 |
| Number of pages | 5 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 5852 PART I |
| DOIs | |
| Publication status | Published - 2005 |
| Externally published | Yes |
| Event | Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics - Singapore, Singapore Duration: 2004 Nov 29 → 2004 Dec 1 |
Keywords
- Fatigue
- Lead-free solder
- Mechanical properties
- Microstructure
- Miniature testing
- Sn-3.0Ag-0.5Cu
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering