| Original language | English |
|---|---|
| Pages (from-to) | 169-170 |
| Journal | TMS Letters |
| Volume | 1 |
| Publication status | Published - 2004 Nov 30 |
Cite this
Kariya, Y., Arai, T., Suga, T., & Otsuka, M. (2004). Mechanical Properties of Lead Free Solder Alloys Evaluated by Miniature Size Specimen. TMS Letters, 1, 169-170.
Mechanical Properties of Lead Free Solder Alloys Evaluated by Miniature Size Specimen. / Kariya, Yoshiharu; Arai, Tsuyoshi; Suga, Tadatomo; Otsuka, Masahisa.
In: TMS Letters, Vol. 1, 30.11.2004, p. 169-170.Research output: Contribution to journal › Article
Kariya, Y, Arai, T, Suga, T & Otsuka, M 2004, 'Mechanical Properties of Lead Free Solder Alloys Evaluated by Miniature Size Specimen', TMS Letters, vol. 1, pp. 169-170.
Kariya Y, Arai T, Suga T, Otsuka M. Mechanical Properties of Lead Free Solder Alloys Evaluated by Miniature Size Specimen. TMS Letters. 2004 Nov 30;1:169-170.
@article{3878fe89f53c44709d721c0134d9eb3e,
title = "Mechanical Properties of Lead Free Solder Alloys Evaluated by Miniature Size Specimen",
author = "Yoshiharu Kariya and Tsuyoshi Arai and Tadatomo Suga and Masahisa Otsuka",
year = "2004",
month = "11",
day = "30",
language = "English",
volume = "1",
pages = "169--170",
journal = "TMS Letters",
}
TY - JOUR
T1 - Mechanical Properties of Lead Free Solder Alloys Evaluated by Miniature Size Specimen
AU - Kariya, Yoshiharu
AU - Arai, Tsuyoshi
AU - Suga, Tadatomo
AU - Otsuka, Masahisa
PY - 2004/11/30
Y1 - 2004/11/30
M3 - Article
VL - 1
SP - 169
EP - 170
JO - TMS Letters
JF - TMS Letters
ER -