Mechanical Properties of Sn-3.0mass%Ag-0.5mass%Cu Alloy

Yoshiharu Kariya, William.J.Plumbridge William.J.Plumbridge

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	383-388
Journal	Proc. of the 7th Symposium on Microjoining and Assembly Technology in Electronics
Volume	7
Publication status	Published - 2001 Feb 1

Cite this

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title = "Mechanical Properties of Sn-3.0mass%Ag-0.5mass%Cu Alloy",

author = "Yoshiharu Kariya and William.J.Plumbridge William.J.Plumbridge",

year = "2001",

month = feb,

day = "1",

language = "English",

volume = "7",

pages = "383--388",

journal = "Proc. of the 7th Symposium on Microjoining and Assembly Technology in Electronics",

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TY - JOUR

T1 - Mechanical Properties of Sn-3.0mass%Ag-0.5mass%Cu Alloy

AU - Kariya, Yoshiharu

AU - William.J.Plumbridge, William.J.Plumbridge

PY - 2001/2/1

Y1 - 2001/2/1

M3 - Article

VL - 7

SP - 383

EP - 388

JO - Proc. of the 7th Symposium on Microjoining and Assembly Technology in Electronics

JF - Proc. of the 7th Symposium on Microjoining and Assembly Technology in Electronics

ER -