Mechanical reliability Assecement technique for lead-free solder using miniature scale specimen

Research output: Contribution to journalArticle

Original languageEnglish
JournalDefault journal
Publication statusPublished - 2003 Dec 1

Cite this

@article{bca53527374b466cab6aecc2895e34cd,
title = "Mechanical reliability Assecement technique for lead-free solder using miniature scale specimen",
author = "Yoshiharu Kariya",
year = "2003",
month = "12",
day = "1",
language = "English",
journal = "Default journal",

}

TY - JOUR

T1 - Mechanical reliability Assecement technique for lead-free solder using miniature scale specimen

AU - Kariya, Yoshiharu

PY - 2003/12/1

Y1 - 2003/12/1

M3 - Article

JO - Default journal

JF - Default journal

ER -