Micro mechanical testing to evaluate mechanical reliability of solder alloys and solder joints

Research output: Contribution to journalArticle

Original languageEnglish
JournalDefault journal
Publication statusPublished - 2005 May 1

Cite this

@article{077a6e874d4c40c3a4851e4fcd94b390,
title = "Micro mechanical testing to evaluate mechanical reliability of solder alloys and solder joints",
author = "Yoshiharu Kariya",
year = "2005",
month = "5",
day = "1",
language = "English",
journal = "Default journal",

}

TY - JOUR

T1 - Micro mechanical testing to evaluate mechanical reliability of solder alloys and solder joints

AU - Kariya, Yoshiharu

PY - 2005/5/1

Y1 - 2005/5/1

M3 - Article

JO - Default journal

JF - Default journal

ER -