Micro mechanical testing to evaluate mechanical reliability of solder alloys and solder joints

Yoshiharu Kariya

Research output: Contribution to journal › Article

Original languageEnglish
JournalDefault journal
Publication statusPublished - 2005 May 1

Cite this

Micro mechanical testing to evaluate mechanical reliability of solder alloys and solder joints. / Kariya, Yoshiharu.

In: Default journal, 01.05.2005.

Research output: Contribution to journal › Article

Kariya, Y 2005, 'Micro mechanical testing to evaluate mechanical reliability of solder alloys and solder joints', Default journal.
Kariya Y. Micro mechanical testing to evaluate mechanical reliability of solder alloys and solder joints. Default journal. 2005 May 1.
Kariya, Yoshiharu. / Micro mechanical testing to evaluate mechanical reliability of solder alloys and solder joints. In: Default journal. 2005.
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