Micro three-dimensional removal processing inside sapphire substrate

Kensuke Tokumi, Shigeki Matsuo, Satoshi Kiyama, Takuro Tomita, Shuichi Hashimoto

Research output: Contribution to journalArticle

Abstract

Femtosecond laser-assisted etching is a promising technique as micro three-dimensional removal processing. This technique consists of two-steps: the first step is irradiation of focused femtosecond (fs) laser pulses along the pre-designed pattern, and next step is wet etching. Provided the modified region is etched faster than the un-modified host material, the modified region is selectively removed. However, when this technique was applied to volume etching of sapphire, there was a problem of incomplete removal (residues remain after etching). In the present report, we propose and demonstrate a new strategy of two-cycle process, i.e., repeating {irradiation-etching} cycle two-times. The region that should be removed was divided into two. Outer layer was etched at the first cycle and inner volume was etched at the second cycle. In this way, the etching capability was improved as well as suppressing undesirable side effects of cracks and surface pits.

Original languageEnglish
Pages (from-to)179-182
Number of pages4
JournalJournal of Laser Micro Nanoengineering
Volume5
Issue number2
DOIs
Publication statusPublished - 2010 Jun
Externally publishedYes

Fingerprint

Sapphire
Etching
sapphire
etching
Substrates
Processing
cycles
Ultrashort pulses
Irradiation
Wet etching
irradiation
lasers
Cracks
cracks
pulses

Keywords

  • Femtosecond laser processing
  • Femtosecond laser-assisted etching
  • Sapphire
  • Two-cycle process

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Instrumentation
  • Electrical and Electronic Engineering

Cite this

Micro three-dimensional removal processing inside sapphire substrate. / Tokumi, Kensuke; Matsuo, Shigeki; Kiyama, Satoshi; Tomita, Takuro; Hashimoto, Shuichi.

In: Journal of Laser Micro Nanoengineering, Vol. 5, No. 2, 06.2010, p. 179-182.

Research output: Contribution to journalArticle

Tokumi, Kensuke ; Matsuo, Shigeki ; Kiyama, Satoshi ; Tomita, Takuro ; Hashimoto, Shuichi. / Micro three-dimensional removal processing inside sapphire substrate. In: Journal of Laser Micro Nanoengineering. 2010 ; Vol. 5, No. 2. pp. 179-182.
@article{3607b0803f094a91bb765b8af1b21d9f,
title = "Micro three-dimensional removal processing inside sapphire substrate",
abstract = "Femtosecond laser-assisted etching is a promising technique as micro three-dimensional removal processing. This technique consists of two-steps: the first step is irradiation of focused femtosecond (fs) laser pulses along the pre-designed pattern, and next step is wet etching. Provided the modified region is etched faster than the un-modified host material, the modified region is selectively removed. However, when this technique was applied to volume etching of sapphire, there was a problem of incomplete removal (residues remain after etching). In the present report, we propose and demonstrate a new strategy of two-cycle process, i.e., repeating {irradiation-etching} cycle two-times. The region that should be removed was divided into two. Outer layer was etched at the first cycle and inner volume was etched at the second cycle. In this way, the etching capability was improved as well as suppressing undesirable side effects of cracks and surface pits.",
keywords = "Femtosecond laser processing, Femtosecond laser-assisted etching, Sapphire, Two-cycle process",
author = "Kensuke Tokumi and Shigeki Matsuo and Satoshi Kiyama and Takuro Tomita and Shuichi Hashimoto",
year = "2010",
month = "6",
doi = "10.2961/jlmn.2010.02.0015",
language = "English",
volume = "5",
pages = "179--182",
journal = "Journal of Laser Micro Nanoengineering",
issn = "1880-0688",
publisher = "Japan Laser Processing",
number = "2",

}

TY - JOUR

T1 - Micro three-dimensional removal processing inside sapphire substrate

AU - Tokumi, Kensuke

AU - Matsuo, Shigeki

AU - Kiyama, Satoshi

AU - Tomita, Takuro

AU - Hashimoto, Shuichi

PY - 2010/6

Y1 - 2010/6

N2 - Femtosecond laser-assisted etching is a promising technique as micro three-dimensional removal processing. This technique consists of two-steps: the first step is irradiation of focused femtosecond (fs) laser pulses along the pre-designed pattern, and next step is wet etching. Provided the modified region is etched faster than the un-modified host material, the modified region is selectively removed. However, when this technique was applied to volume etching of sapphire, there was a problem of incomplete removal (residues remain after etching). In the present report, we propose and demonstrate a new strategy of two-cycle process, i.e., repeating {irradiation-etching} cycle two-times. The region that should be removed was divided into two. Outer layer was etched at the first cycle and inner volume was etched at the second cycle. In this way, the etching capability was improved as well as suppressing undesirable side effects of cracks and surface pits.

AB - Femtosecond laser-assisted etching is a promising technique as micro three-dimensional removal processing. This technique consists of two-steps: the first step is irradiation of focused femtosecond (fs) laser pulses along the pre-designed pattern, and next step is wet etching. Provided the modified region is etched faster than the un-modified host material, the modified region is selectively removed. However, when this technique was applied to volume etching of sapphire, there was a problem of incomplete removal (residues remain after etching). In the present report, we propose and demonstrate a new strategy of two-cycle process, i.e., repeating {irradiation-etching} cycle two-times. The region that should be removed was divided into two. Outer layer was etched at the first cycle and inner volume was etched at the second cycle. In this way, the etching capability was improved as well as suppressing undesirable side effects of cracks and surface pits.

KW - Femtosecond laser processing

KW - Femtosecond laser-assisted etching

KW - Sapphire

KW - Two-cycle process

UR - http://www.scopus.com/inward/record.url?scp=79956370122&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79956370122&partnerID=8YFLogxK

U2 - 10.2961/jlmn.2010.02.0015

DO - 10.2961/jlmn.2010.02.0015

M3 - Article

AN - SCOPUS:79956370122

VL - 5

SP - 179

EP - 182

JO - Journal of Laser Micro Nanoengineering

JF - Journal of Laser Micro Nanoengineering

SN - 1880-0688

IS - 2

ER -