Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint

Hiroyuki Kontani, Yoshiharu Kariya, Tomoya Fumikura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this study, the relationship between microstructural change and fracture in the process of low-cycle fatigue of Sn- Ag-Cu solder joint was investigated using the solder ball of 630 μm and 100 μm in diameter by analysis of crystallographic orientation by means of EBSD. The 630 μm specimen has subgrain boundaries formed by dynamic recovery in the stress concentration region, and the subgrain boundaries become highangle random grain boundaries by additional cycles. The fatigue crack stably propagates along the random grain boundary in the stress concentration region. In contrast, the 100 μm specimen has subgrain boundaries and high-angle random grain boundaries formed across the entire joint area. Since the occurrence of grain boundary fracture across the entire joint area by the connection of high energy grain boundaries, the crack propagation life of the 100 μm specimen shortens without the stable crack growth compared to the 630 m specimen.

Original languageEnglish
Title of host publicationASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Volume1
DOIs
Publication statusPublished - 2013
EventASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA
Duration: 2013 Jul 162013 Jul 18

Other

OtherASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
CityBurlingame, CA
Period13/7/1613/7/18

Fingerprint

Fatigue damage
Soldering alloys
Grain boundaries
Stress concentration
Crack propagation
Fatigue of materials
Recovery

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Networks and Communications
  • Computer Science Applications
  • Hardware and Architecture
  • Information Systems
  • Electronic, Optical and Magnetic Materials

Cite this

Kontani, H., Kariya, Y., & Fumikura, T. (2013). Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint. In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 (Vol. 1) https://doi.org/10.1115/IPACK2013-73192

Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint. / Kontani, Hiroyuki; Kariya, Yoshiharu; Fumikura, Tomoya.

ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. Vol. 1 2013.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kontani, H, Kariya, Y & Fumikura, T 2013, Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint. in ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. vol. 1, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013, Burlingame, CA, 13/7/16. https://doi.org/10.1115/IPACK2013-73192
Kontani H, Kariya Y, Fumikura T. Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint. In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. Vol. 1. 2013 https://doi.org/10.1115/IPACK2013-73192
Kontani, Hiroyuki ; Kariya, Yoshiharu ; Fumikura, Tomoya. / Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint. ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. Vol. 1 2013.
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