Original language | English |
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Journal | Proc. Of International Conference on Electronics Materials and Packaging |
Volume | EMAP2011 |
Publication status | Published - 2011 Dec 1 |
Microstructure and Fatigue Damage of Eutectic Bi-Sn Alloy at High Temperature
T. Sato, Y. K, a a, Y. Kariya
Research output: Contribution to journal › Article › peer-review