Microstructure and Isothermal Fatigue Characteristics of Sn-Ag-X(X=Bi,Cu,Zn) Solder Alloys and Solder/Copper Joint

Yoshiharu Kariya, Yasuo Oguchi, Masahisa Otsuka

Research output: Contribution to journalArticle

Original languageEnglish
JournalDefault journal
Publication statusPublished - 1998 Apr 1

Cite this

Microstructure and Isothermal Fatigue Characteristics of Sn-Ag-X(X=Bi,Cu,Zn) Solder Alloys and Solder/Copper Joint. / Kariya, Yoshiharu; Oguchi, Yasuo; Otsuka, Masahisa.

In: Default journal, 01.04.1998.

Research output: Contribution to journalArticle

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AU - Oguchi, Yasuo

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