Microstructure and texture of electroplated copper in damascene structures

M. E. Gross, C. Lingk, T. Siegrist, E. Coleman, W. L. Brown, Kazuyoshi Ueno, Y. Tsuchiya, N. Itoh, T. Ritzdorf, J. Turner, K. Gibbons, E. Klawuhn, M. Biberger, W. Y C Lai, J. F. Miner, al et al

Research output: Chapter in Book/Report/Conference proceedingConference contribution

22 Citations (Scopus)

Abstract

The transition from Al to Cu for advanced ULSI interconnects involves changes in architecture and deposition technique that will influence the microstructure and texture of the metal. Cu interconnects are typically formed within the confines of pre-patterned trenches and vias using an electroplating process with a sputtered Cu conduction layer deposited over a refractory metal-based diffusion barrier layer. In this paper, we focus on the influence of the barrier layer (PVD Ti/TiN, Ta, TaN, CVD TiN) and the effect of a vacuum break between barrier and conduction layer depositions, on the texture of the Cu lines, as examined by X-ray diffraction pole figure analysis. A preferred (111) orientation was observed for all samples. The samples with no vacuum break between barrier and conduction layer deposition exhibited in plane anisotropy that was particularly pronounced for the Ta and TaN samples compared with the Ti/TiN sample. Focused ion beam images and transmission electron micrographs showed Cu grain size to be on the order of the trench width with a high degree of twinning, and no boundary could be distinguished between the PVD Cu conduction layer and the electroplated Cu.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium - Proceedings
PublisherMRS
Pages293-298
Number of pages6
Volume514
Publication statusPublished - 1998
Externally publishedYes
EventProceedings of the 1998 MRS Spring Symposium - San Francisco, CA, USA
Duration: 1998 Apr 131998 Apr 16

Other

OtherProceedings of the 1998 MRS Spring Symposium
CitySan Francisco, CA, USA
Period98/4/1398/4/16

Fingerprint

Copper
Textures
Physical vapor deposition
Microstructure
Vacuum
Refractory metals
Diffusion barriers
Focused ion beams
Twinning
Electroplating
Chemical vapor deposition
Poles
Anisotropy
Metals
X ray diffraction
Electrons

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Gross, M. E., Lingk, C., Siegrist, T., Coleman, E., Brown, W. L., Ueno, K., ... et al, A. (1998). Microstructure and texture of electroplated copper in damascene structures. In Materials Research Society Symposium - Proceedings (Vol. 514, pp. 293-298). MRS.

Microstructure and texture of electroplated copper in damascene structures. / Gross, M. E.; Lingk, C.; Siegrist, T.; Coleman, E.; Brown, W. L.; Ueno, Kazuyoshi; Tsuchiya, Y.; Itoh, N.; Ritzdorf, T.; Turner, J.; Gibbons, K.; Klawuhn, E.; Biberger, M.; Lai, W. Y C; Miner, J. F.; et al, al.

Materials Research Society Symposium - Proceedings. Vol. 514 MRS, 1998. p. 293-298.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Gross, ME, Lingk, C, Siegrist, T, Coleman, E, Brown, WL, Ueno, K, Tsuchiya, Y, Itoh, N, Ritzdorf, T, Turner, J, Gibbons, K, Klawuhn, E, Biberger, M, Lai, WYC, Miner, JF & et al, A 1998, Microstructure and texture of electroplated copper in damascene structures. in Materials Research Society Symposium - Proceedings. vol. 514, MRS, pp. 293-298, Proceedings of the 1998 MRS Spring Symposium, San Francisco, CA, USA, 98/4/13.
Gross ME, Lingk C, Siegrist T, Coleman E, Brown WL, Ueno K et al. Microstructure and texture of electroplated copper in damascene structures. In Materials Research Society Symposium - Proceedings. Vol. 514. MRS. 1998. p. 293-298
Gross, M. E. ; Lingk, C. ; Siegrist, T. ; Coleman, E. ; Brown, W. L. ; Ueno, Kazuyoshi ; Tsuchiya, Y. ; Itoh, N. ; Ritzdorf, T. ; Turner, J. ; Gibbons, K. ; Klawuhn, E. ; Biberger, M. ; Lai, W. Y C ; Miner, J. F. ; et al, al. / Microstructure and texture of electroplated copper in damascene structures. Materials Research Society Symposium - Proceedings. Vol. 514 MRS, 1998. pp. 293-298
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