Microstructure of electroplated copper in damascene structures: effects of barrier layers and geometry

M.E.Gross M.E.Gross, E.Coleman E.Coleman, W.Lai W.Lai, J.Miner J.Miner, T.Ritzdorf T.Ritzdorf, J.Turner J.Turner, K.Gibbons K.Gibbons, E.klawuhn E.klawuhn, M.Biberger M.Biberger, K.Ueno K.Ueno, Y.Tsuchiya Y.Tsuchiya, N.Ito N.Ito, Kazuyoshi Ueno

Research output: Contribution to journalArticle

Original languageEnglish
JournalAdvanced Interconnects and Contact Materials and Processes for Future ICs
Publication statusPublished - 1997 Oct 1

Cite this

Microstructure of electroplated copper in damascene structures: effects of barrier layers and geometry. / M.E.Gross, M.E.Gross; E.Coleman, E.Coleman; W.Lai, W.Lai; J.Miner, J.Miner; T.Ritzdorf, T.Ritzdorf; J.Turner, J.Turner; K.Gibbons, K.Gibbons; E.klawuhn, E.klawuhn; M.Biberger, M.Biberger; K.Ueno, K.Ueno; Y.Tsuchiya, Y.Tsuchiya; N.Ito, N.Ito; Ueno, Kazuyoshi.

In: Advanced Interconnects and Contact Materials and Processes for Future ICs, 01.10.1997.

Research output: Contribution to journalArticle

M.E.Gross, MEG, E.Coleman, EC, W.Lai, WL, J.Miner, JM, T.Ritzdorf, TR, J.Turner, JT, K.Gibbons, KG, E.klawuhn, EK, M.Biberger, MB, K.Ueno, KU, Y.Tsuchiya, YT, N.Ito, NI & Ueno, K 1997, 'Microstructure of electroplated copper in damascene structures: effects of barrier layers and geometry', Advanced Interconnects and Contact Materials and Processes for Future ICs.
M.E.Gross, M.E.Gross ; E.Coleman, E.Coleman ; W.Lai, W.Lai ; J.Miner, J.Miner ; T.Ritzdorf, T.Ritzdorf ; J.Turner, J.Turner ; K.Gibbons, K.Gibbons ; E.klawuhn, E.klawuhn ; M.Biberger, M.Biberger ; K.Ueno, K.Ueno ; Y.Tsuchiya, Y.Tsuchiya ; N.Ito, N.Ito ; Ueno, Kazuyoshi. / Microstructure of electroplated copper in damascene structures: effects of barrier layers and geometry. In: Advanced Interconnects and Contact Materials and Processes for Future ICs. 1997.
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AU - E.Coleman, E.Coleman

AU - W.Lai, W.Lai

AU - J.Miner, J.Miner

AU - T.Ritzdorf, T.Ritzdorf

AU - J.Turner, J.Turner

AU - K.Gibbons, K.Gibbons

AU - E.klawuhn, E.klawuhn

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AU - K.Ueno, K.Ueno

AU - Y.Tsuchiya, Y.Tsuchiya

AU - N.Ito, N.Ito

AU - Ueno, Kazuyoshi

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JO - Advanced Interconnects and Contact Materials and Processes for Future ICs

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