Microstructure of electroplated copper in damascene structures: effects of barrier layers and geometry

M.E.Gross M.E.Gross, E.Coleman E.Coleman, W.Lai W.Lai, J.Miner J.Miner, T.Ritzdorf T.Ritzdorf, J.Turner J.Turner, K.Gibbons K.Gibbons, E.klawuhn E.klawuhn, M.Biberger M.Biberger, K.Ueno K.Ueno, Y.Tsuchiya Y.Tsuchiya, N.Ito N.Ito, Kazuyoshi Ueno

Research output: Contribution to journalArticle

Original languageEnglish
JournalAdvanced Interconnects and Contact Materials and Processes for Future ICs
Publication statusPublished - 1997 Oct 1

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M.E.Gross, M. E. G., E.Coleman, E. C., W.Lai, W. L., J.Miner, J. M., T.Ritzdorf, T. R., J.Turner, J. T., K.Gibbons, K. G., E.klawuhn, E. K., M.Biberger, M. B., K.Ueno, K. U., Y.Tsuchiya, Y. T., N.Ito, N. I., & Ueno, K. (1997). Microstructure of electroplated copper in damascene structures: effects of barrier layers and geometry. Advanced Interconnects and Contact Materials and Processes for Future ICs.