Microstructure of electroplated copper in damascene structures: effects of barrier layers and geometry

M.E.Gross M.E.Gross; E.Coleman E.Coleman; W.Lai W.Lai; J.Miner J.Miner; T.Ritzdorf T.Ritzdorf; J.Turner J.Turner; K.Gibbons K.Gibbons; E.klawuhn E.klawuhn; M.Biberger M.Biberger; K.Ueno K.Ueno; Y.Tsuchiya Y.Tsuchiya; N.Ito N.Ito; Kazuyoshi Ueno

Microstructure of electroplated copper in damascene structures: effects of barrier layers and geometry

M.E.Gross M.E.Gross, E.Coleman E.Coleman, W.Lai W.Lai, J.Miner J.Miner, T.Ritzdorf T.Ritzdorf, J.Turner J.Turner, K.Gibbons K.Gibbons, E.klawuhn E.klawuhn, M.Biberger M.Biberger, K.Ueno K.Ueno, Y.Tsuchiya Y.Tsuchiya, N.Ito N.Ito, Kazuyoshi Ueno

Functional Control Systems

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	Advanced Interconnects and Contact Materials and Processes for Future ICs
Publication status	Published - 1997 Oct 1

Cite this

M.E.Gross, M. E. G., E.Coleman, E. C., W.Lai, W. L., J.Miner, J. M., T.Ritzdorf, T. R., J.Turner, J. T., K.Gibbons, K. G., E.klawuhn, E. K., M.Biberger, M. B., K.Ueno, K. U., Y.Tsuchiya, Y. T., N.Ito, N. I., & Ueno, K. (1997). Microstructure of electroplated copper in damascene structures: effects of barrier layers and geometry. Advanced Interconnects and Contact Materials and Processes for Future ICs.

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author = "M.E.Gross M.E.Gross and E.Coleman E.Coleman and W.Lai W.Lai and J.Miner J.Miner and T.Ritzdorf T.Ritzdorf and J.Turner J.Turner and K.Gibbons K.Gibbons and E.klawuhn E.klawuhn and M.Biberger M.Biberger and K.Ueno K.Ueno and Y.Tsuchiya Y.Tsuchiya and N.Ito N.Ito and Kazuyoshi Ueno",

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T1 - Microstructure of electroplated copper in damascene structures: effects of barrier layers and geometry

AU - M.E.Gross, M.E.Gross

AU - E.Coleman, E.Coleman

AU - W.Lai, W.Lai

AU - J.Miner, J.Miner

AU - T.Ritzdorf, T.Ritzdorf

AU - J.Turner, J.Turner

AU - K.Gibbons, K.Gibbons

AU - E.klawuhn, E.klawuhn

AU - M.Biberger, M.Biberger

AU - K.Ueno, K.Ueno

AU - Y.Tsuchiya, Y.Tsuchiya

AU - N.Ito, N.Ito

AU - Ueno, Kazuyoshi

PY - 1997/10/1

Y1 - 1997/10/1

M3 - Article

JO - Advanced Interconnects and Contact Materials and Processes for Future ICs

JF - Advanced Interconnects and Contact Materials and Processes for Future ICs

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