| Original language | English |
|---|---|
| Journal | Advanced Metallization Conference in 1999 |
| Publication status | Published - 1999 Oct 1 |
Microstructure of electroplated Cu films
H.Okabayashi H.Okabayashi, K.Ueno K.Ueno, N.Ito N.Ito, S.Saito S.Saito, E.Nomura E.Nomura, Kazuyoshi Ueno
Research output: Contribution to journal › Article › peer-review