Microstructure of electroplated Cu films

H.Okabayashi H.Okabayashi, K.Ueno K.Ueno, N.Ito N.Ito, S.Saito S.Saito, E.Nomura E.Nomura, Kazuyoshi Ueno

Research output: Contribution to journalArticle

Original languageEnglish
JournalAdvanced Metallization Conference in 1999
Publication statusPublished - 1999 Oct 1

Cite this

H.Okabayashi, H. O., K.Ueno, K. U., N.Ito, N. I., S.Saito, S. S., E.Nomura, E. N., & Ueno, K. (1999). Microstructure of electroplated Cu films. Advanced Metallization Conference in 1999.

Microstructure of electroplated Cu films. / H.Okabayashi, H.Okabayashi; K.Ueno, K.Ueno; N.Ito, N.Ito; S.Saito, S.Saito; E.Nomura, E.Nomura; Ueno, Kazuyoshi.

In: Advanced Metallization Conference in 1999, 01.10.1999.

Research output: Contribution to journalArticle

H.Okabayashi, HO, K.Ueno, KU, N.Ito, NI, S.Saito, SS, E.Nomura, EN & Ueno, K 1999, 'Microstructure of electroplated Cu films', Advanced Metallization Conference in 1999.
H.Okabayashi HO, K.Ueno KU, N.Ito NI, S.Saito SS, E.Nomura EN, Ueno K. Microstructure of electroplated Cu films. Advanced Metallization Conference in 1999. 1999 Oct 1.
H.Okabayashi, H.Okabayashi ; K.Ueno, K.Ueno ; N.Ito, N.Ito ; S.Saito, S.Saito ; E.Nomura, E.Nomura ; Ueno, Kazuyoshi. / Microstructure of electroplated Cu films. In: Advanced Metallization Conference in 1999. 1999.
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