Millimeter-wave three-dimensional masterslice MMICs

Kenjiro Nishikawa, Kenji Kamogawa, Koh Inoue, Kiyomitsu Onodera, Makoto Hirano, Tsuneo Tokumitsu, Ichihiko Toyoda

    Research output: Contribution to journalConference article

    8 Citations (Scopus)

    Abstract

    The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-db gain and a 5.3 dB noise figure in an area of 0.27 mm2. A U-band single-chip downconverter is also demonstrated.

    Original languageEnglish
    Pages (from-to)313-316
    Number of pages4
    JournalIEEE MTT-S International Microwave Symposium Digest
    Volume1
    Publication statusPublished - 1998 Jan 1
    EventProceedings of the 1998 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Baltimore, MD, USA
    Duration: 1998 Jun 71998 Jun 12

    ASJC Scopus subject areas

    • Radiation
    • Condensed Matter Physics
    • Electrical and Electronic Engineering

    Fingerprint Dive into the research topics of 'Millimeter-wave three-dimensional masterslice MMICs'. Together they form a unique fingerprint.

  • Cite this

    Nishikawa, K., Kamogawa, K., Inoue, K., Onodera, K., Hirano, M., Tokumitsu, T., & Toyoda, I. (1998). Millimeter-wave three-dimensional masterslice MMICs. IEEE MTT-S International Microwave Symposium Digest, 1, 313-316.