Millimeter-wave three-dimensional masterslice MMICs

Kenjiro Nishikawa, Kenji Kamogawa, Koh Inoue, Kiyomitsu Onodera, Makoto Hirano, Tsuneo Tokumitsu, Ichihiko Toyoda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-db gain and a 5.3 dB noise figure in an area of 0.27 mm 2. A U-band single-chip downconverter is also demonstrated.

Original languageEnglish
Title of host publicationIEEE MTT-S International Microwave Symposium Digest
EditorsR. Meixner
PublisherIEEE
Pages313-316
Number of pages4
Volume1
Publication statusPublished - 1998
Externally publishedYes
EventProceedings of the 1998 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Baltimore, MD, USA
Duration: 1998 Jun 71998 Jun 12

Other

OtherProceedings of the 1998 IEEE MTT-S International Microwave Symposium. Part 1 (of 3)
CityBaltimore, MD, USA
Period98/6/798/6/12

Fingerprint

Turnaround time
Monolithic microwave integrated circuits
Noise figure
extremely high frequencies
Millimeter waves
millimeter waves
amplifiers
chips
costs
Fabrication
fabrication
Costs

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Nishikawa, K., Kamogawa, K., Inoue, K., Onodera, K., Hirano, M., Tokumitsu, T., & Toyoda, I. (1998). Millimeter-wave three-dimensional masterslice MMICs. In R. Meixner (Ed.), IEEE MTT-S International Microwave Symposium Digest (Vol. 1, pp. 313-316). IEEE.

Millimeter-wave three-dimensional masterslice MMICs. / Nishikawa, Kenjiro; Kamogawa, Kenji; Inoue, Koh; Onodera, Kiyomitsu; Hirano, Makoto; Tokumitsu, Tsuneo; Toyoda, Ichihiko.

IEEE MTT-S International Microwave Symposium Digest. ed. / R. Meixner. Vol. 1 IEEE, 1998. p. 313-316.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nishikawa, K, Kamogawa, K, Inoue, K, Onodera, K, Hirano, M, Tokumitsu, T & Toyoda, I 1998, Millimeter-wave three-dimensional masterslice MMICs. in R Meixner (ed.), IEEE MTT-S International Microwave Symposium Digest. vol. 1, IEEE, pp. 313-316, Proceedings of the 1998 IEEE MTT-S International Microwave Symposium. Part 1 (of 3), Baltimore, MD, USA, 98/6/7.
Nishikawa K, Kamogawa K, Inoue K, Onodera K, Hirano M, Tokumitsu T et al. Millimeter-wave three-dimensional masterslice MMICs. In Meixner R, editor, IEEE MTT-S International Microwave Symposium Digest. Vol. 1. IEEE. 1998. p. 313-316
Nishikawa, Kenjiro ; Kamogawa, Kenji ; Inoue, Koh ; Onodera, Kiyomitsu ; Hirano, Makoto ; Tokumitsu, Tsuneo ; Toyoda, Ichihiko. / Millimeter-wave three-dimensional masterslice MMICs. IEEE MTT-S International Microwave Symposium Digest. editor / R. Meixner. Vol. 1 IEEE, 1998. pp. 313-316
@inproceedings{16c4abcde0bb45be882c874deeaa88d7,
title = "Millimeter-wave three-dimensional masterslice MMICs",
abstract = "The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-db gain and a 5.3 dB noise figure in an area of 0.27 mm 2. A U-band single-chip downconverter is also demonstrated.",
author = "Kenjiro Nishikawa and Kenji Kamogawa and Koh Inoue and Kiyomitsu Onodera and Makoto Hirano and Tsuneo Tokumitsu and Ichihiko Toyoda",
year = "1998",
language = "English",
volume = "1",
pages = "313--316",
editor = "R. Meixner",
booktitle = "IEEE MTT-S International Microwave Symposium Digest",
publisher = "IEEE",

}

TY - GEN

T1 - Millimeter-wave three-dimensional masterslice MMICs

AU - Nishikawa, Kenjiro

AU - Kamogawa, Kenji

AU - Inoue, Koh

AU - Onodera, Kiyomitsu

AU - Hirano, Makoto

AU - Tokumitsu, Tsuneo

AU - Toyoda, Ichihiko

PY - 1998

Y1 - 1998

N2 - The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-db gain and a 5.3 dB noise figure in an area of 0.27 mm 2. A U-band single-chip downconverter is also demonstrated.

AB - The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-db gain and a 5.3 dB noise figure in an area of 0.27 mm 2. A U-band single-chip downconverter is also demonstrated.

UR - http://www.scopus.com/inward/record.url?scp=0031645239&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0031645239&partnerID=8YFLogxK

M3 - Conference contribution

VL - 1

SP - 313

EP - 316

BT - IEEE MTT-S International Microwave Symposium Digest

A2 - Meixner, R.

PB - IEEE

ER -