Millimeter-wave three-dimensional masterslice MMICs

Kenjiro Nishikawa, Kenji Kamogawa, Koh Inoue, Kiyomitsu Onodera, Makoto Hirano, Tsuneo Tokumitsu, Ichihiko Toyoda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-dB gain and a 5.3 dB noise figure in an area of 0.27 mm2. A U-band single-chip downconverter is also demonstrated.

Original languageEnglish
Title of host publicationIEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers
Place of PublicationPiscataway, NJ, United States
PublisherIEEE
Pages239-242
Number of pages4
Publication statusPublished - 1998
Externally publishedYes
EventProceedings of the 1998 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium - Baltimore, MD, USA
Duration: 1998 Jun 71998 Jun 11

Other

OtherProceedings of the 1998 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium
CityBaltimore, MD, USA
Period98/6/798/6/11

Fingerprint

Turnaround time
Monolithic microwave integrated circuits
Noise figure
Millimeter waves
Fabrication
Costs

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Media Technology

Cite this

Nishikawa, K., Kamogawa, K., Inoue, K., Onodera, K., Hirano, M., Tokumitsu, T., & Toyoda, I. (1998). Millimeter-wave three-dimensional masterslice MMICs. In IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers (pp. 239-242). Piscataway, NJ, United States: IEEE.

Millimeter-wave three-dimensional masterslice MMICs. / Nishikawa, Kenjiro; Kamogawa, Kenji; Inoue, Koh; Onodera, Kiyomitsu; Hirano, Makoto; Tokumitsu, Tsuneo; Toyoda, Ichihiko.

IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers. Piscataway, NJ, United States : IEEE, 1998. p. 239-242.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nishikawa, K, Kamogawa, K, Inoue, K, Onodera, K, Hirano, M, Tokumitsu, T & Toyoda, I 1998, Millimeter-wave three-dimensional masterslice MMICs. in IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers. IEEE, Piscataway, NJ, United States, pp. 239-242, Proceedings of the 1998 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, Baltimore, MD, USA, 98/6/7.
Nishikawa K, Kamogawa K, Inoue K, Onodera K, Hirano M, Tokumitsu T et al. Millimeter-wave three-dimensional masterslice MMICs. In IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers. Piscataway, NJ, United States: IEEE. 1998. p. 239-242
Nishikawa, Kenjiro ; Kamogawa, Kenji ; Inoue, Koh ; Onodera, Kiyomitsu ; Hirano, Makoto ; Tokumitsu, Tsuneo ; Toyoda, Ichihiko. / Millimeter-wave three-dimensional masterslice MMICs. IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers. Piscataway, NJ, United States : IEEE, 1998. pp. 239-242
@inproceedings{0a884ef32abd48fbab8a02f80f9ef884,
title = "Millimeter-wave three-dimensional masterslice MMICs",
abstract = "The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-dB gain and a 5.3 dB noise figure in an area of 0.27 mm2. A U-band single-chip downconverter is also demonstrated.",
author = "Kenjiro Nishikawa and Kenji Kamogawa and Koh Inoue and Kiyomitsu Onodera and Makoto Hirano and Tsuneo Tokumitsu and Ichihiko Toyoda",
year = "1998",
language = "English",
pages = "239--242",
booktitle = "IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers",
publisher = "IEEE",

}

TY - GEN

T1 - Millimeter-wave three-dimensional masterslice MMICs

AU - Nishikawa, Kenjiro

AU - Kamogawa, Kenji

AU - Inoue, Koh

AU - Onodera, Kiyomitsu

AU - Hirano, Makoto

AU - Tokumitsu, Tsuneo

AU - Toyoda, Ichihiko

PY - 1998

Y1 - 1998

N2 - The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-dB gain and a 5.3 dB noise figure in an area of 0.27 mm2. A U-band single-chip downconverter is also demonstrated.

AB - The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-dB gain and a 5.3 dB noise figure in an area of 0.27 mm2. A U-band single-chip downconverter is also demonstrated.

UR - http://www.scopus.com/inward/record.url?scp=0031645627&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0031645627&partnerID=8YFLogxK

M3 - Conference contribution

SP - 239

EP - 242

BT - IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers

PB - IEEE

CY - Piscataway, NJ, United States

ER -