Millimeter-wave three-dimensional masterslice MMICs

Kenjiro Nishikawa, Kenji Kamogawa, Koh Inoue, Kiyomitsu Onodera, Makoto Hirano, Tsuneo Tokumitsu, Ichihiko Toyoda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-dB gain and a 5.3 dB noise figure in an area of 0.27 mm2. A U-band single-chip downconverter is also demonstrated.

Original languageEnglish
Title of host publicationIEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers
Place of PublicationPiscataway, NJ, United States
PublisherIEEE
Pages239-242
Number of pages4
Publication statusPublished - 1998
Externally publishedYes
EventProceedings of the 1998 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium - Baltimore, MD, USA
Duration: 1998 Jun 71998 Jun 11

Other

OtherProceedings of the 1998 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium
CityBaltimore, MD, USA
Period98/6/798/6/11

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Media Technology

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  • Cite this

    Nishikawa, K., Kamogawa, K., Inoue, K., Onodera, K., Hirano, M., Tokumitsu, T., & Toyoda, I. (1998). Millimeter-wave three-dimensional masterslice MMICs. In IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers (pp. 239-242). IEEE.