Miniaturization of double stub resonators using lumped-element capacitors for MMIC applications

Shinichi Tanaka, Takao Katayose, Hiroki Nishizawa, Ken'Ichi Hosoya, Ryo Ishikawa, Kazuhiko Honjo

Research output: Contribution to journalArticle

Abstract

We present a design method for miniaturizing double stub resonators that are potentially very useful for wide range of applications but have limited usage for MMICs due to their large footprint. The analytical design model, which we introduce in this paper, allows for determining the capacitances needed to achieve the targeted shrinking ratio while maintaining the original loaded-Q before miniaturization. To verify the model, 18-GHz stub resonators that are around 40% of the original sizes were designed and fabricated in GaAs MMIC technology. The effectiveness of the proposed technique is also demonstrated by a 9-GHz low phase-noise oscillator using the miniaturized resonator.

Original languageEnglish
Pages (from-to)830-836
Number of pages7
JournalIEICE Transactions on Electronics
VolumeE99C
Issue number7
DOIs
Publication statusPublished - 2016 Jul 1

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Monolithic microwave integrated circuits
Resonators
Capacitors
Phase noise
Capacitance

Keywords

  • Coplanar waveguide
  • Microstrip line
  • MMIC
  • Oscillators
  • Phase noise
  • Q-factor
  • Resonator

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Miniaturization of double stub resonators using lumped-element capacitors for MMIC applications. / Tanaka, Shinichi; Katayose, Takao; Nishizawa, Hiroki; Hosoya, Ken'Ichi; Ishikawa, Ryo; Honjo, Kazuhiko.

In: IEICE Transactions on Electronics, Vol. E99C, No. 7, 01.07.2016, p. 830-836.

Research output: Contribution to journalArticle

Tanaka, Shinichi ; Katayose, Takao ; Nishizawa, Hiroki ; Hosoya, Ken'Ichi ; Ishikawa, Ryo ; Honjo, Kazuhiko. / Miniaturization of double stub resonators using lumped-element capacitors for MMIC applications. In: IEICE Transactions on Electronics. 2016 ; Vol. E99C, No. 7. pp. 830-836.
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