Multichip Module Technology using AIN Substrate for 2-Gbit/s High-Speed Switching Module

Y. Iseki, F. Shimizu, T. Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)973-978
JournalECTC(Electronic Components and Technology Conference) '92
Publication statusPublished - 1992 May 1

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