Multichip Module Technology using AIN Substrate for 2-Gbit/s High-Speed Switching Module

Y. Iseki, F. Shimizu, T. Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)973-978
JournalECTC(Electronic Components and Technology Conference) '92
Publication statusPublished - 1992 May 1

Cite this

Multichip Module Technology using AIN Substrate for 2-Gbit/s High-Speed Switching Module. / Iseki, Y.; Shimizu, F.; Sudo, T.

In: ECTC(Electronic Components and Technology Conference) '92, 01.05.1992, p. 973-978.

Research output: Contribution to journalArticle

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