Multilevel planarized trench aluminum (PTA) interconnection using reflow sputtering and chemical mechanical polishing

K.Kikuta K.Kikuta, T.Nakajima T.Nakajima, K.Ueno K.Ueno, T.Kikkawa T.Kikkawa, Kazuyoshi Ueno

Research output: Contribution to journal › Article › peer-review

Cite this

@article{eb2375a9834e4493a24810c36fafe28b,

title = "Multilevel planarized trench aluminum (PTA) interconnection using reflow sputtering and chemical mechanical polishing",

author = "K.Kikuta K.Kikuta and T.Nakajima T.Nakajima and K.Ueno K.Ueno and T.Kikkawa T.Kikkawa and Kazuyoshi Ueno",

year = "1993",

month = dec,

day = "1",

language = "English",

pages = "285--288",

journal = "1993 IEDM Technical Digest",

}

TY - JOUR

T1 - Multilevel planarized trench aluminum (PTA) interconnection using reflow sputtering and chemical mechanical polishing

AU - K.Kikuta, K.Kikuta

AU - T.Nakajima, T.Nakajima

AU - K.Ueno, K.Ueno

AU - T.Kikkawa, T.Kikkawa

AU - Ueno, Kazuyoshi

PY - 1993/12/1

Y1 - 1993/12/1

M3 - Article

SP - 285

EP - 288

JO - 1993 IEDM Technical Digest

JF - 1993 IEDM Technical Digest

ER -