Multilevel planarized trench aluminum (PTA) interconnection using reflow sputtering and chemical mechanical polishing

K.Kikuta K.Kikuta, T.Nakajima T.Nakajima, K.Ueno K.Ueno, T.Kikkawa T.Kikkawa, Kazuyoshi Ueno

Research output: Contribution to journalArticle

11 Citations (Scopus)
Original languageEnglish
Pages (from-to)285-288
Journal1993 IEDM Technical Digest
Publication statusPublished - 1993 Dec 1

Cite this

Multilevel planarized trench aluminum (PTA) interconnection using reflow sputtering and chemical mechanical polishing. / K.Kikuta, K.Kikuta; T.Nakajima, T.Nakajima; K.Ueno, K.Ueno; T.Kikkawa, T.Kikkawa; Ueno, Kazuyoshi.

In: 1993 IEDM Technical Digest, 01.12.1993, p. 285-288.

Research output: Contribution to journalArticle

K.Kikuta, K.Kikuta ; T.Nakajima, T.Nakajima ; K.Ueno, K.Ueno ; T.Kikkawa, T.Kikkawa ; Ueno, Kazuyoshi. / Multilevel planarized trench aluminum (PTA) interconnection using reflow sputtering and chemical mechanical polishing. In: 1993 IEDM Technical Digest. 1993 ; pp. 285-288.
@article{eb2375a9834e4493a24810c36fafe28b,
title = "Multilevel planarized trench aluminum (PTA) interconnection using reflow sputtering and chemical mechanical polishing",
author = "K.Kikuta K.Kikuta and T.Nakajima T.Nakajima and K.Ueno K.Ueno and T.Kikkawa T.Kikkawa and Kazuyoshi Ueno",
year = "1993",
month = "12",
day = "1",
language = "English",
pages = "285--288",
journal = "1993 IEDM Technical Digest",

}

TY - JOUR

T1 - Multilevel planarized trench aluminum (PTA) interconnection using reflow sputtering and chemical mechanical polishing

AU - K.Kikuta, K.Kikuta

AU - T.Nakajima, T.Nakajima

AU - K.Ueno, K.Ueno

AU - T.Kikkawa, T.Kikkawa

AU - Ueno, Kazuyoshi

PY - 1993/12/1

Y1 - 1993/12/1

M3 - Article

SP - 285

EP - 288

JO - 1993 IEDM Technical Digest

JF - 1993 IEDM Technical Digest

ER -