Multilevel planarized trench aluminum (PTA) interconnection using reflow sputtering and chemical mechanical polishing

K.Kikuta K.Kikuta, T.Nakajima T.Nakajima, K.Ueno K.Ueno, T.Kikkawa T.Kikkawa, Kazuyoshi Ueno

Research output: Contribution to journalArticle

11 Citations (Scopus)
Original languageEnglish
Pages (from-to)285-288
Journal1993 IEDM Technical Digest
Publication statusPublished - 1993 Dec 1

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