Multilevel planarized-trench-aluminum (PTA) interconnection using reflow sputtering and chemical mechanical polishing

K. Kikuta, T. Nakajima, K. Ueno, T. Kikkawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Multilevel planarized-trench-aluminum (PTA) interconnection using reflow sputtering and chemical mechanical polishing'. Together they form a unique fingerprint.

Engineering & Materials Science

Physics & Astronomy

Chemical Compounds