Near-field acoustic levitation of 8 inches Si wafer and glass substrate using flexural vibration

Yoshiki Hashimoto, Yoshikazu Koike, Sadayuki Ueha

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In the conventional acoustic levitation, the specimen to be levitated is limited to very light ones of a few milligrams to a few tens of milligrams. The authors found out that the specimen with several kilograms can be levitated stably by direct sound radiation pressure and that the specimen irrespective of material can be levitated in order of a few kilograms. The requirement is only the surface of the specimen exposed against sound wave to be flat. In this report, the fundamental characteristics of the near filed levitation were experimentally studied with use of a flexural vibration plate. Following results were obtained: (1) The size of the levitation specimen should be longer than 3/2 wavelength of the flexural vibration in order to levitate stably. (2) The relationship between the levitation distance and the mass of unit area is in proportion to -1/2 power. (3) The levitation distance is also proportion to the displacement amplitude. This phenomenon is applicable to non-contact transportation of planar object such as 8 inch Si wafer and LCD glass substrate with superimposed ultrasonic wave on vibration plate.

Original languageEnglish
Title of host publicationInstitute of Environmental Sciences - Proceedings, Annual Technical Meeting
PublisherInst of Environmental Sciences
Pages500-505
Number of pages6
Publication statusPublished - 1996
Externally publishedYes
EventProceedings of the 1996 42nd Annual Technical Meeting of the Institute of Environmental Sciences - Orlando, FL, USA
Duration: 1996 May 121996 May 16

Other

OtherProceedings of the 1996 42nd Annual Technical Meeting of the Institute of Environmental Sciences
CityOrlando, FL, USA
Period96/5/1296/5/16

Fingerprint

Acoustic fields
Vibrations (mechanical)
Acoustic waves
Glass
Ultrasonic waves
Substrates
Liquid crystal displays
Acoustics
Radiation
Wavelength

ASJC Scopus subject areas

  • Environmental Engineering

Cite this

Hashimoto, Y., Koike, Y., & Ueha, S. (1996). Near-field acoustic levitation of 8 inches Si wafer and glass substrate using flexural vibration. In Institute of Environmental Sciences - Proceedings, Annual Technical Meeting (pp. 500-505). Inst of Environmental Sciences.

Near-field acoustic levitation of 8 inches Si wafer and glass substrate using flexural vibration. / Hashimoto, Yoshiki; Koike, Yoshikazu; Ueha, Sadayuki.

Institute of Environmental Sciences - Proceedings, Annual Technical Meeting. Inst of Environmental Sciences, 1996. p. 500-505.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hashimoto, Y, Koike, Y & Ueha, S 1996, Near-field acoustic levitation of 8 inches Si wafer and glass substrate using flexural vibration. in Institute of Environmental Sciences - Proceedings, Annual Technical Meeting. Inst of Environmental Sciences, pp. 500-505, Proceedings of the 1996 42nd Annual Technical Meeting of the Institute of Environmental Sciences, Orlando, FL, USA, 96/5/12.
Hashimoto Y, Koike Y, Ueha S. Near-field acoustic levitation of 8 inches Si wafer and glass substrate using flexural vibration. In Institute of Environmental Sciences - Proceedings, Annual Technical Meeting. Inst of Environmental Sciences. 1996. p. 500-505
Hashimoto, Yoshiki ; Koike, Yoshikazu ; Ueha, Sadayuki. / Near-field acoustic levitation of 8 inches Si wafer and glass substrate using flexural vibration. Institute of Environmental Sciences - Proceedings, Annual Technical Meeting. Inst of Environmental Sciences, 1996. pp. 500-505
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