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New bonding mechanism of 50 μm pitch TAB-ILB with 0.25 μm Sn plated Cu lead
Eiichi Hosomi, Chiaki Takubo, Hiroshi Tazawa, Koji Shibasaki, Yoichi Hiruta, Toshio Sudo
Research output: Contribution to journal › Conference article › peer-review
1
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(Scopus)