New polyimide film paves way for super high-speed logic devices

Tetsuya Homma; Youichiro Numasawa; Yukinobu Murao; Kuniyuki Hamano

New polyimide film paves way for super high-speed logic devices

Tetsuya Homma, Youichiro Numasawa, Yukinobu Murao, Kuniyuki Hamano

Research output: Contribution to journal › Article › peer-review

Abstract

Multilevel interconnection technology has become essential for the development of high density and high integration of LSIs in recent years. Planarization of interlayer dielectrics is very important for highly reliable, fine multilevel interconnections. In this article, we will discuss the development process and the features of a new polyimide siloxane film in contrast with problems of conventional polyimide film, and will outline the practical application.

Original language	English
Pages (from-to)	74-79
Number of pages	6
Journal	JEE. Journal of electronic engineering
Volume	25
Issue number	263
Publication status	Published - 1988 Nov 1
Externally published	Yes

ASJC Scopus subject areas

Engineering(all)

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abstract = "Multilevel interconnection technology has become essential for the development of high density and high integration of LSIs in recent years. Planarization of interlayer dielectrics is very important for highly reliable, fine multilevel interconnections. In this article, we will discuss the development process and the features of a new polyimide siloxane film in contrast with problems of conventional polyimide film, and will outline the practical application.",

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AU - Numasawa, Youichiro

AU - Murao, Yukinobu

AU - Hamano, Kuniyuki

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N2 - Multilevel interconnection technology has become essential for the development of high density and high integration of LSIs in recent years. Planarization of interlayer dielectrics is very important for highly reliable, fine multilevel interconnections. In this article, we will discuss the development process and the features of a new polyimide siloxane film in contrast with problems of conventional polyimide film, and will outline the practical application.

AB - Multilevel interconnection technology has become essential for the development of high density and high integration of LSIs in recent years. Planarization of interlayer dielectrics is very important for highly reliable, fine multilevel interconnections. In this article, we will discuss the development process and the features of a new polyimide siloxane film in contrast with problems of conventional polyimide film, and will outline the practical application.

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New polyimide film paves way for super high-speed logic devices

Abstract

ASJC Scopus subject areas

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