Abstract
Multilevel interconnection technology has become essential for the development of high density and high integration of LSIs in recent years. Planarization of interlayer dielectrics is very important for highly reliable, fine multilevel interconnections. In this article, we will discuss the development process and the features of a new polyimide siloxane film in contrast with problems of conventional polyimide film, and will outline the practical application.
| Original language | English |
|---|---|
| Pages (from-to) | 74-79 |
| Number of pages | 6 |
| Journal | JEE. Journal of electronic engineering |
| Volume | 25 |
| Issue number | 263 |
| Publication status | Published - 1988 Nov 1 |
ASJC Scopus subject areas
- Engineering(all)
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Cite this
Homma, T., Numasawa, Y., Murao, Y., & Hamano, K. (1988). New polyimide film paves way for super high-speed logic devices. JEE. Journal of electronic engineering, 25(263), 74-79.