New polyimide film paves way for super high-speed logic devices

Tetsuya Homma, Youichiro Numasawa, Yukinobu Murao, Kuniyuki Hamano

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Multilevel interconnection technology has become essential for the development of high density and high integration of LSIs in recent years. Planarization of interlayer dielectrics is very important for highly reliable, fine multilevel interconnections. In this article, we will discuss the development process and the features of a new polyimide siloxane film in contrast with problems of conventional polyimide film, and will outline the practical application.

Original languageEnglish
Pages (from-to)74-79
Number of pages6
JournalJEE. Journal of electronic engineering
Volume25
Issue number263
Publication statusPublished - 1988 Nov 1

ASJC Scopus subject areas

  • Engineering(all)

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